# US 2013/0154094 A1 · Anisotropic conductive film composition, anisotropic conductive film, and semiconductor device

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- Number: US 2013/0154094 A1
- Document ID: US20130154094A1
- Status: Published application
- Kind: A1
- Application number: 13/713,404
- Filed: 2012-12-13
- Published: 2013-06-20
- Earliest claimed: 2011-12-16
- Assignees: Cheil Industries Inc.
- Inventors: Kyoung Hun Shin; Do Hyun Park; Hyun Joo Seo; Young Ju Shin; Kang Bae Yoon
- Web page: https://patentgrep.com/patent/US20130154094A1

## CPC

- H10W 70/666: {Organic materials or pastes}
- C09J 7/20: characterised by their carriers
- C09J 9/00: Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks (C09J7/00 takes precedence)
- C09J 11/08: Macromolecular additives
- H01B 1/20: Conductive material dispersed in non-conductive organic material {(organic macromolecular compounds or compositions C08)}
- C08K 5/00: Use of organic ingredients
- C08K 2201/001: Conductive additives
- C09J 2203/326: for bonding electronic components such as wafers, chips or semiconductors
- C09J 2301/314: the adhesive layer and/or the carrier being conductive
- C09J 2301/408: additives as essential feature of the adhesive layer
- C09J 2423/04: Presence of homo or copolymers of ethene
- C09J 2475/00: Presence of polyurethane
- H10W 72/325: {Die-attach connectors having a filler embedded in a matrix}
- H10W 72/351: {Materials of die-attach connectors}
- H10W 72/352: {comprising metals or metalloids, e.g. solders}
- H10W 72/353: {not comprising solid metals or solid metalloids, e.g. ceramics}
- H10W 72/354: {comprising polymers}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H)
- H01B: CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES (selection for magnetic properties H01F1/00; waveguides H01P {; printed circuits H05K})
- C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09)

## Abstract

A semiconductor device is bonded by an anisotropic conductive film composition. The anisotropic conductive film composition includes an ethylene-vinyl acetate copolymer, a polyurethane resin, and organic fine particles. The anisotropic conductive film composition has a melt viscosity of about 2,000 to about 8,000 Pa·s at 80° C.

## Claims

### Claim 1

A semiconductor device bonded by an anisotropic conductive film composition, the anisotropic conductive film composition comprising:
an ethylene-vinyl acetate copolymer;
a polyurethane resin; and
organic fine particles;
wherein the anisotropic conductive film composition has a melt viscosity of about 2,000 to about 8,000 Pa·s at 80° C.

### Claim 2 (depends on 1)

The semiconductor device as claimed in claim 1, wherein the anisotropic conductive film composition includes:
about 5 to about 50 parts by weight of the ethylene-vinyl acetate copolymer;
about 10 to about 70 parts by weight of the polyurethane resin; and
about 0.1 to about 30 parts by weight of the organic fine particles;
based on 100 parts by weight of a solid content of the anisotropic conductive film composition.

### Claim 3 (depends on 1)

The semiconductor device as claimed in claim 1, wherein the organic fine particles include organic fine particles of at least one of styrene-divinylbenzene, chlorinated polyethylene, dimethyl polysiloxane, methylmethacrylate-butylacrylate-dimethylsiloxane copolymers, styrene-butadiene-styrene block copolymers, styrene-butadiene thermoplastic elastomers, butadiene rubbers, styrene-butadiene rubbers, and ethylene glycidyl methacrylate.

### Claim 4

A semiconductor device bonded by an anisotropic conductive film, the anisotropic conductive film including:
an ethylene-vinyl acetate copolymer;
a polyurethane resin; and
organic fine particles;
wherein the anisotropic conductive film has an adhesive strength of about 1,000 gf/cm or more after pressing at 150° C. and 4 MPa for 4 seconds.

### Claim 5 (depends on 4)

The semiconductor device as claimed in claim 4, wherein the organic fine particles include organic fine particles of at least one of styrene-divinylbenzene, chlorinated polyethylene, dimethyl polysiloxane, methylmethacrylate-butylacrylate-dimethylsiloxane copolymers, styrene-butadiene-styrene block copolymers, styrene-butadiene thermoplastic elastomers, butadiene rubbers, styrene-butadiene rubbers, and ethylene glycidyl methacrylate.

### Claim 6 (depends on 4)

The semiconductor device as claimed in claim 4, wherein the anisotropic conductive film has an adhesive strength of about 800 gf/cm or more after pressing at 150° C. and 4 MPa for 4 seconds and then storage at 85° C. and 85% RH for 500 hours.

### Claim 7 (depends on 4)

The semiconductor device as claimed in claim 4, wherein the anisotropic conductive film has a bubble area of 10% or less based on an area of spaces between electrodes after pressing at 150° C. and 4 MPa for 4 seconds and then storage at 85° C. and 85% RH for 500 hours.

### Claim 8 (depends on 4)

The semiconductor device as claimed in claim 4, wherein the anisotropic conductive film has a melt viscosity of about 2,000 to about 8,000 Pa·s at 80° C.