# US 2013/0154092 A1 · Integrated circuit packaging system with conductive pillars and method of manufacture thereof > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2013/0154092 A1 - Document ID: US20130154092A1 - Status: Published application - Kind: A1 - Application number: 13/327,609 - Filed: 2011-12-15 - Published: 2013-06-20 - Earliest claimed: 2011-12-15 - Assignees: STATS ChipPAC Pte. Ltd. - Inventors: DeokKyung Yang; In Sang Yoon; SeongHun Mun; KyungHwan Kim - Web page: https://patentgrep.com/patent/US20130154092A1 ## CPC - H10W 90/00: Package configurations - H10W 90/28: the stacked chips having different sizes, e.g. chip stacks having a pyramidal shape - H10W 72/20: Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps - H10W 72/877: {Bump connectors and die-attach connectors} - H10W 74/117: {the substrate having spherical bumps for external connection} - H10W 74/142: {the encapsulations exposing the passive side of the semiconductor body} - H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills - H10W 90/284: {characterised by structural arrangements for measuring or testing} - H10W 90/722: {between stacked chips} - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W 90/726: {between a chip and a stacked lead frame, conducting package substrate or heat sink} - H10W 90/732: {between stacked chips} - H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W 90/736: {between a chip and a stacked lead frame, conducting package substrate or heat sink} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A method of manufacture of an integrated circuit packaging system including: providing a package carrier; mounting an integrated circuit to the package carrier; mounting a circuit interposer above the integrated circuit; mounting a mounting integrated circuit above the circuit interposer; forming a conductive pillar to the circuit interposer adjacent to the mounting integrated circuit; connecting the circuit interposer to the package carrier; and forming an encapsulation on the package carrier. ## Claims ### Claim 1 A method of manufacture of an integrated circuit packaging system comprising: providing a package carrier; mounting an integrated circuit to the package carrier; mounting a circuit interposer above the integrated circuit; mounting a mounting integrated circuit above the circuit interposer; forming a conductive pillar to the circuit interposer adjacent to the mounting integrated circuit; connecting the circuit interposer to the package carrier; and forming an encapsulation on the package carrier. ### Claim 2 (depends on 1) The method as claimed in claim 1 wherein connecting the circuit interposer to the package carrier includes electrically connecting the circuit interposer to the package carrier with interposer electrical connectors. ### Claim 3 (depends on 1) The method as claimed in claim 1 wherein connecting the circuit interposer to the package carrier includes electrically connecting the circuit interposer to the package carrier with solder balls. ### Claim 4 (depends on 1) The method as claimed in claim 1 wherein forming the conductive pillar on the circuit interposer includes forming the conductive pillar at a level planar with the top of the encapsulation. ### Claim 5 (depends on 1) The method as claimed in claim 1 wherein forming the encapsulation on the package carrier is at a level planar with the conductive pillar and below the non-active surface of the mounting integrated circuit. ### Claim 6 A method of manufacture of an integrated circuit packaging system (100) comprising: providing a package carrier; mounting an integrated circuit to the package carrier; mounting an integrated circuit interposer above the integrated circuit; mounting a mounting integrated circuit above the circuit interposer; forming a conductive pillar to the circuit interposer adjacent to the mounting integrated circuit; connecting the circuit interposer to the package carrier; and forming an encapsulation on the package carrier. ### Claim 7 (depends on 6) The method as claimed in claim 6 wherein connecting the circuit interposer to the package carrier includes electrically connecting the circuit interposer to the package carrier with interposer electrical connectors. ### Claim 8 (depends on 6) The method as claimed in claim 6 wherein connecting the circuit interposer to the package carrier includes electrically connecting the circuit interposer to the package carrier with solder ball. ### Claim 9 (depends on 6) The method as claimed in claim 6 wherein forming the conductive pillar on the circuit interposer includes forming the conductive pillar at a level planar with the top of the encapsulation. ### Claim 10 (depends on 6) The method as claimed in claim 6 wherein forming the encapsulation on the package carrier includes forming the encapsulation at a level planar with the conductive pillar and below the non-active surface of the mounting integrated circuit. ### Claim 11 An integrated circuit packaging system comprising: a package carrier; an integrated circuit mounted to the package carrier; a circuit interposer mounted above the integrated circuit; a mounting integrated circuit mounted above the circuit interposer; a conductive pillar formed to the circuit interposer adjacent to the mounting integrated circuit; the circuit interposer connected to the package carrier; and an encapsulation formed on the package carrier. ### Claim 12 (depends on 11) The system as claimed in claim 11 further comprising interposer electrical connectors between the integrated circuit and the package carrier. ### Claim 13 (depends on 11) The system as claimed in claim 11 further comprising solder balls between the circuit interposer and the package carrier. ### Claim 14 (depends on 11) The system as claimed in claim 11 wherein the conductive pillar is at a level planar with the top of the encapsulation. ### Claim 15 (depends on 11) The system as claimed in claim 11 wherein the conductive pillar formed to the circuit interposer is at a level planar with the conductive pillar and below the non-active surface of the mounting integrated circuit. ### Claim 16 (depends on 11) The system as claimed in claim 11 wherein the circuit interposer mounted above the integrated circuit is an integrated circuit interposer. ### Claim 17 (depends on 16) The system as claimed in claim 16 wherein the circuit interposer mounted above the integrated circuit is electrically connected to the package carrier with bond wire interposer electrical connectors. ### Claim 18 (depends on 16) The system as claimed in claim 16 wherein the circuit interposer mounted above the integrated circuit is electrically connected to the package carrier with solder balls. ### Claim 19 (depends on 16) The system as claimed in claim 16 wherein the conductive pillar formed to the circuit interposer includes the conductive pillar at a level planar with the top of the encapsulation. ### Claim 20 (depends on 16) The system as claimed in claim 16 further comprising the conductive pillar formed to the circuit interposer is at a level planar with the conductive pillar and below the non-active surface of the mounting integrated circuit.