# US 2013/0154085 A1 · Integrated circuit packaging system with heat conduction and method of manufacture thereof

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- Number: US 2013/0154085 A1
- Document ID: US20130154085A1
- Status: Published application
- Kind: A1
- Application number: 13/325,530
- Filed: 2011-12-14
- Published: 2013-06-20
- Earliest claimed: 2011-12-14
- Assignees: STATS ChipPAC, Ltd.
- Inventors: DaeSik Choi; SangMi Park; MinJung Kim; MinWook Yu
- Web page: https://patentgrep.com/patent/US20130154085A1

## CPC

- H10W 40/10: Arrangements for heating
- H10W 72/877: {Bump connectors and die-attach connectors}
- H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills
- H10W 76/60: Seals
- H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts}
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 95/00: Packaging processes not covered by the other groups of this subclass
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A method of manufacture of an integrated circuit packaging system includes: providing a substrate; mounting an integrated circuit over the substrate; mounting a lid base over the substrate, the lid base having a base indentation and a hole with the integrated circuit within the hole; and mounting a heat slug over the lid base, the heat slug having a slug non-horizontal side partially within the base indentation.

## Claims

### Claim 1

A method of manufacture of an integrated circuit packaging system comprising:
providing a substrate;
mounting an integrated circuit over the substrate;
mounting a lid base over the substrate, the lid base having a base indentation and a hole with the integrated circuit within the hole; and
mounting a heat slug over the lid base, the heat slug having a slug non-horizontal side partially within the base indentation.

### Claim 2 (depends on 1)

The method as claimed in claim 1 further comprising:
attaching a base-slug adhesive layer to the lid base; and
wherein:
mounting the heat slug includes mounting the heat slug over the integrated circuit with the base-slug adhesive layer directly on a portion of the slug non-horizontal side.

### Claim 3 (depends on 1)

The method as claimed in claim 1 wherein mounting the lid base includes mounting the lid base having a cavity below the base indentation.

### Claim 4 (depends on 1)

The method as claimed in claim 1 wherein mounting the heat slug includes mounting the heat slug having a slug protrusion partially within the base indentation.

### Claim 5 (depends on 1)

The method as claimed in claim 1 wherein mounting the lid base includes mounting the lid base having a leg portion, a portion of the leg portion below a substrate bottom side of the substrate.

### Claim 6

A method of manufacture of an integrated circuit packaging system comprising:
providing a substrate;
mounting an integrated circuit over the substrate;
mounting a lid base over the substrate, the lid base having a base indentation and a hole with the integrated circuit within the hole;
attaching a thermal interface layer to the lid base; and
mounting a heat slug directly on the thermal interface layer, the heat slug having a slug non-horizontal side partially within the base indentation.

### Claim 7 (depends on 6)

The method as claimed in claim 6 further comprising:
attaching a base-slug adhesive layer to the lid base; and
wherein:
mounting the heat slug includes mounting the heat slug over the integrated circuit, the heat slug having a slug bottom side with the base-slug adhesive layer directly on portions of the slug non-horizontal side and the slug bottom side.

### Claim 8 (depends on 6)

The method as claimed in claim 6 wherein:
mounting the lid base includes mounting the lid base having a cavity below the base indentation; and
further comprising:
attaching a base-slug adhesive layer to the lid base, the base-slug adhesive layer within the cavity.

### Claim 9 (depends on 6)

The method as claimed in claim 6 wherein mounting the heat slug includes mounting the heat slug having a slug bottom side and a slug protrusion, the slug protrusion extending from the slug bottom side and partially within the base indentation.

### Claim 10 (depends on 6)

The method as claimed in claim 6 wherein mounting the lid base includes mounting the lid base having a leg portion, a portion of the leg portion below a substrate bottom side of the substrate, another portion of the leg portion directly on a substrate non-horizontal side of the substrate.

### Claim 11

An integrated circuit packaging system comprising:
a substrate;
an integrated circuit over the substrate;
a lid base over the substrate, the lid base having a base indentation and a hole with the integrated circuit within the hole; and
a heat slug over the lid base, the heat slug having a slug non-horizontal side partially within the base indentation.

### Claim 12 (depends on 11)

The system as claimed in claim 11 further comprising:
a base-slug adhesive layer attached to the lid base; and
wherein:
the heat slug is over the integrated circuit with the base-slug adhesive layer directly on a portion of the slug non-horizontal side.

### Claim 13 (depends on 11)

The system as claimed in claim 11 wherein the lid base includes a cavity below the base indentation.

### Claim 14 (depends on 11)

The system as claimed in claim 11 wherein the heat slug includes a slug protrusion partially within the base indentation.

### Claim 15 (depends on 11)

The system as claimed in claim 11 wherein the lid base includes a leg portion, a portion of the leg portion below a substrate bottom side of the substrate.

### Claim 16 (depends on 11)

The system as claimed in claim 11 further comprising:
a thermal interface layer attached to the lid base; and
wherein:
the heat slug is directly on the thermal interface layer.

### Claim 17 (depends on 16)

The system as claimed in claim 16 further comprising:
a base-slug adhesive layer attached to the lid base; and
wherein:
the heat slug is over the integrated circuit, the heat slug having a slug bottom side with the base-slug adhesive layer directly on portions of the slug non-horizontal side and the slug bottom side.

### Claim 18 (depends on 16)

The system as claimed in claim 16 wherein:
the lid base includes a cavity below the base indentation; and
further comprising:
a base-slug adhesive layer attached to the lid base, the base-slug adhesive layer within the cavity.

### Claim 19 (depends on 16)

The system as claimed in claim 16 wherein the heat slug includes a slug bottom side and a slug protrusion, the slug protrusion extending from the slug bottom side and partially within the base indentation.

### Claim 20 (depends on 16)

The system as claimed in claim 16 wherein the lid base includes a leg portion, a portion of the leg portion below a substrate bottom side of the substrate, another portion of the leg portion directly on a substrate non-horizontal side of the substrate.