# US 2013/0154081 A1 · Semiconductor module

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- Number: US 2013/0154081 A1
- Document ID: US20130154081A1
- Status: Published application
- Kind: A1
- Application number: 13/819,221
- Filed: 2010-09-02
- Published: 2013-06-20
- Earliest claimed: 2010-09-02
- Assignees: Toyota Jidoshi Kabushiki Kaisha
- Inventors: Takuya Kadoguchi; Yoshikazu Suzuki; Masaya Kaji; Kiyofumi Nakajima; Tatsuya Miyoshi; Takanori Kawashima; Tomomi Okumura
- Web page: https://patentgrep.com/patent/US20130154081A1

## CPC

- H10W 40/00: Arrangements for thermal protection or thermal control (integrated devices comprising arrangements for thermal protection H10D89/60)
- H10W 40/10: Arrangements for heating
- H10W 40/47: by flowing liquids, e.g. forced water cooling
- H10W 40/611: {Bolts or screws}
- H10W 40/778: {in encapsulations}
- H10W 70/442: {of multiple leadframes in a single chip}
- H10W 72/07336: {Soldering or alloying}
- H10W 72/07636: {Soldering or alloying}
- H10W 72/07653: {changes in shapes}
- H10W 72/347: {Dispositions of multiple die-attach connectors}
- H10W 72/351: {Materials of die-attach connectors}
- H10W 72/5524: {comprising aluminium [Al]}
- H10W 72/652: {comprising metals or metalloids, e.g. silver}
- H10W 72/865: {Die-attach connectors and bond wires}
- H10W 72/871: {Bond wires and strap connectors}
- H10W 72/884: {Die-attach connectors and bond wires}
- H10W 74/00: Encapsulations, e.g. protective coatings
- H10W 90/00: Package configurations
- H10W 90/736: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10W 90/766: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A semiconductor module which includes a semiconductor device; a wiring member that is connected to the semiconductor device; a cooling plate that includes a first surface on a side of the semiconductor device and a second surface on a side opposite to the first surface and has a fastening portion at an end thereof in a first direction; and a molded portion that is formed by molding a resin on the semiconductor device, the wiring member and the cooling plate, wherein the fastening portion is exposed out of the molded portion, and a terminal portion of the wiring member is exposed out of the molded portion such that the terminal portion of the wiring member extends in a second direction which is substantially perpendicular to the first direction.

## Claims

### Claim at position 1

1-11. (canceled)

### Claim 12

A semiconductor module comprising:
a semiconductor device;
a wiring member that is connected to the semiconductor device;
a cooling plate that includes a first surface on a side of the semiconductor device and a second surface on a side opposite to the first surface and has a fastening portion at an end thereof in a first direction;
a molded portion that is formed by molding a resin on the semiconductor device, the wiring member and the cooling plate, a heat sink part that is provided between the semiconductor device and the first surface of the cooling plate on the side of the semiconductor device; and
an insulating material that is provided between the heat sink part and the first surface of the cooling plate on the side of the semiconductor device;
wherein the fastening portion is exposed out of the molded portion, and a terminal portion of the wiring member is exposed out of the molded portion such that the terminal portion of the wiring member extends in a second direction which is substantially perpendicular to the first direction,
the heat sink part and the insulating material are disposed in the molded portion
the cooling plate includes fins on the second surface,
the insulating material includes an end that extends outwardly with respect to an end of the heat sink part, and
the fins of the cooling plate are formed at a center side with respect to the end of the heat sink part.

### Claim 13 (depends on 12)

The semiconductor module of claim 12, wherein the terminal portion of the wiring member is exposed out of the molded portion only in the first direction.

### Claim 14 (depends on 12)

The semiconductor module of claim 12, wherein the wiring member is formed by a lead frame.

### Claim 15 (depends on 12)

The semiconductor module of claim 12, wherein the molded portion includes an extended side portion at a region of the cooling plate where the fastening portion does not exist, the extended side portion extending to be coplanar with the second surface of the cooling plate such that it is brought into intimate contact with a side surface of the cooling plate.

### Claim 16 (depends on 15)

The semiconductor module of claim 15, wherein the second surface of the cooling plate includes a thin portion, and
the extended side portion of the molded portion covers the second surface of the cooling plate at the thin portion.

### Claim 17 (depends on 12)

The semiconductor module of claim 12, wherein a seal portion is provided between a fluid channel for a cooling medium and the second surface of the cooling plate and at a center side with respect to the fastening portion.

### Claim 18 (depends on 12)

The semiconductor module of claim 12, wherein the molded portion includes a rib portion at a side portion region thereof where the terminal portion of the wiring member is exposed, the rib portion projecting outwardly with respect a neighboring side portion region.

### Claim 19 (depends on 12)

The semiconductor module of claim 12, wherein the cooling plate includes fastening portions provided at opposite ends thereof in the first direction,
the fastening portions of the cooling plate are formed in a region that projects in the first direction with respect to another region in the corresponding ends of the cooling plate,
the molded portion is formed at a center side of the cooling plate in the first direction with respect to the fastening portions of the cooling plate, and
the fastening portion of one end of the cooling plate is formed at a position that has an offset in the second direction with respect to the fastening portion of another end of the cooling plate.

### Claim 20 (depends on 12)

The semiconductor module of claim 12, wherein the cooling plate includes fastening portions provided at opposite ends thereof in the first direction,
the fastening portions of the cooling plate are formed to have a thickness smaller than a center portion of the cooling plate, and
the fastening portion of one end of the cooling plate in the first direction is coplanar with the first surface of the cooling plate on the side of the semiconductor device, and the fastening portion of another end of the cooling plate in the first direction is coplanar with the second surface of the cooling plate.

### Claim 21 (depends on 12)

The semiconductor module of claim 12, wherein the cooling plate is fastened to a channel forming member at the fastening portion, the channel forming member forming a cooling medium channel in which a cooling medium flows.

### Claim 22 (depends on 1)

A hybrid system comprising the semiconductor module of claim 1.