# US 2013/0154071 A1 · Isolation Barrier Device and Methods of Use

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 2013/0154071 A1
- Document ID: US20130154071A1
- Status: Published application
- Kind: A1
- Application number: 13/325,582
- Filed: 2011-12-14
- Published: 2013-06-20
- Earliest claimed: 2011-12-14
- Assignees: Samsung Electro-Mechanics Co., Ltd.
- Inventors: Geoffrey T. Haigh; Matthew Kuhn; Patrick Melet; Romain Pelard; Jae Joon Chang; Youngsik Hur
- Web page: https://patentgrep.com/patent/US20130154071A1

## CPC

- H10W 70/411: {Chip-supporting parts, e.g. die pads}
- H10W 70/468: {Circuit boards}
- H10W 70/475: {Capacitors in combination with leadframes}
- H10W 90/811: {Multiple chips on leadframes}
- H10W 70/63: Vias, e.g. via plugs
- H10W 72/07554: {changes in dispositions}
- H10W 72/5445: {being orthogonal to a side surface of the chip, e.g. parallel arrangements}
- H10W 72/5449: {not being orthogonal to a side surface of the chip, e.g. fan-out arrangements}
- H10W 72/547: {Dispositions of multiple bond wires}
- H10W 72/932: {Plan-view shape, i.e. in top view}
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/728: {between a chip and a stacked discrete passive device, e.g. resistors, capacitors or inductors}
- H10W 90/753: {between laterally-adjacent chips}
- H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10W 90/759: {between a chip and a laterally-adjacent discrete passive device}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

Systems and methods pertaining to a digital signal isolator device are described. In one embodiment, the device includes an isolation barrier and two metal support paddles. The isolation barrier contains an organic and/or a semi-organic insulating material with at least one capacitor embedded inside. One of the two metal support paddles is located below a first portion of a bottom surface of the isolation barrier to provide support to the isolation barrier, while the other metal support paddle is located below a second portion of a bottom surface of the isolation barrier to provide support to the isolation barrier.

## Claims

### Claim 1

A digital signal isolator device comprising:
an isolation barrier comprising at least one of an organic or a semi-organic insulating material;
a capacitor comprising a pair of parallel capacitor plates embedded inside the isolation barrier;
a first metal support paddle located below a first portion of a bottom surface of the isolation barrier to provide support to the isolation barrier; and
a second metal support paddle located below a second portion of a bottom surface of the isolation barrier to provide support to the isolation barrier.

### Claim 2 (depends on 1)

The device of claim 1, wherein the organic insulating material comprises a polyimide.

### Claim 3 (depends on 1)

The device of claim 1, wherein the semi-organic insulating material comprises a silicon-based polymer.

### Claim 4 (depends on 1)

The device of claim 1, further comprising:
a first die mounted at a first location on a major surface of the isolation barrier with a first bonding wire providing a first electrically conductive path between a first terminal of the first die and a first plate of the pair of parallel capacitor plates; and
a second die mounted at a second location on the major surface of the isolation barrier, with a second bonding wire providing a second electrically conductive path between a first terminal of the second die and a second plate of the pair of parallel capacitor plates.

### Claim 5 (depends on 4)

The device of claim 4, further comprising:
a lead frame comprising a plurality of externally-accessible pins of the device;
a third bonding wire providing a third electrically conductive path between a second terminal of the first die and at least one externally-accessible pin of the lead frame; and
a fourth bonding wire providing a fourth electrically conductive path between a second terminal of the second die and at least another externally-accessible pin of the lead frame.

### Claim 6 (depends on 1)

The device of claim 1, wherein the first metal support paddle extends beyond a first edge of the isolation barrier, the second metal support paddle extends beyond a second edge of the isolation barrier, and further comprising:
a first die mounted on an extension portion of the first metal support paddle;
a second die mounted on an extension portion of the second metal support paddle;
a first bonding wire providing a first electrically conductive path between a first terminal of the first die and a first plate of the pair of parallel capacitor plates embedded inside the isolation barrier; and
a second bonding wire providing a second electrically conductive path between a first terminal of the second die and a second plate of the pair of parallel capacitor plates embedded inside the isolation barrier.

### Claim 7 (depends on 6)

The device of claim 6, further comprising:
a lead frame comprising a plurality of externally-accessible pins of the device;
a third bonding wire providing a third electrically conductive path between a second terminal of the first die and at least one externally-accessible pin of the lead frame; and
a fourth bonding wire providing a fourth electrically conductive path between a second terminal of the second die and at least another externally-accessible pin of the lead frame.

### Claim 8

A digital signal isolator device comprising:
a first metal support paddle;
a second metal support paddle that is electrically isolated from the first metal support paddle; and
an isolation barrier comprising at least one of an organic or a semi-organic insulating material, the isolation barrier having a first portion supported by the first metal support paddle and a second portion supported by the second metal support.

### Claim 9 (depends on 8)

The device of claim 8, wherein the first metal support paddle includes a first externally-accessible pin of the device, and the second metal support paddle includes a second externally-accessible pin of the device.

### Claim 10 (depends on 8)

The device of claim 8, wherein the first metal support paddle extends beyond a first edge of the isolation barrier, the second metal support paddle extends beyond a second edge of the isolation barrier, and further comprising:
a pair of parallel capacitor plates embedded inside the isolation barrier;
a first die mounted on an extension portion of the first metal support paddle;
a second die mounted on an extension portion of the second metal support paddle;
a first bonding wire providing a first electrically conductive path between a first terminal of the first die and a first plate of the pair of parallel capacitor plates embedded inside the isolation barrier; and
a second bonding wire providing a second electrically conductive path between a first terminal of the second die and a second plate of the pair of parallel capacitor plates embedded inside the isolation barrier.

### Claim 11 (depends on 8)

The device of claim 8, further comprising:
a pair of parallel capacitor plates embedded inside the isolation barrier;
a first die mounted at a first location on a major surface of the isolation barrier with a first bonding wire providing a first electrically conductive path between a first terminal of the first die and a first plate of the pair of parallel capacitor plates; and
a second die mounted at a second location on the major surface of the isolation barrier, with a second bonding wire providing a second electrically conductive path between a first terminal of the second die and a second plate of the pair of parallel capacitor plates.

### Claim 12 (depends on 8)

The device of claim 8, further comprising:
a pair of parallel capacitor plates embedded inside the isolation barrier;
a first flip-chip die mounted at a first location on a major surface of the isolation barrier with a first terminal of the first flip-chip die bonded to a bonding pad connected to a first plate of the pair of parallel capacitor plates; and
a second flip-chip die mounted at a second location on the major surface of the isolation barrier with a first terminal of the second flip-chip die bonded to a bonding pad connected to a second plate of the pair of parallel capacitor plates.

### Claim 13

A digital signal isolator device comprising:
an isolation barrier comprising at least one of an organic or a semi-organic insulating material; and
a serial capacitor arrangement embedded inside the isolation barrier, the serial capacitor arrangement comprising a first portion of a first capacitor plate arranged in parallel with at least a portion of a second capacitor plate, and a second portion of the first capacitor plate arranged in parallel with at least a portion of a third capacitor plate.

### Claim 14 (depends on 13)

The device of claim 13, further comprising:
a first metal support paddle, with an extension portion of the first metal support paddle extending beyond a first edge of the isolation barrier;
a second metal support paddle that is electrically isolated from the first support paddle, with an extension portion of the second metal support paddle extending beyond a second edge of the isolation barrier;
a first die mounted on the extension portion of the first metal support paddle;
a second die mounted on the extension portion of the second metal support paddle;
a first bonding wire providing a first electrically conductive path between a first terminal of the first die and the second capacitor plate embedded inside the isolation barrier; and
a second bonding wire providing a second electrically conductive path between a first terminal of the second die and the third capacitor plate embedded inside the isolation barrier.

### Claim 15 (depends on 13)

The device of claim 13, further comprising:
a first metal support paddle;
a second metal support paddle that is electrically isolated from the first support paddle;
a first die mounted at a first location on a major surface of the isolation barrier;
a second die mounted at a second location on the major surface of the isolation barrier;
a first bonding wire providing a first electrically conductive path between a first terminal of the first die and the second capacitor plate embedded inside the isolation barrier; and
a second bonding wire providing a second electrically conductive path between a first terminal of the second die and the third capacitor plate embedded inside the isolation barrier.

### Claim 16 (depends on 13)

The device of claim 13, further comprising:
a first flip-chip die mounted at a first location on a major surface of the isolation barrier with a first terminal of the first flip-chip die bonded to a first bonding pad connected to the second capacitor plate embedded inside the isolation barrier; and
a second flip-chip die mounted at a second location on the major surface of the isolation barrier with a first terminal of the second flip-chip die bonded to a second bonding pad connected to the third capacitor plate embedded inside the isolation barrier.

### Claim 17 (depends on 13)

The device of claim 13, wherein the serial capacitor arrangement further comprises:
a fourth capacitor plate embedded inside the isolation barrier, the fourth capacitor plate arranged in between the first and second capacitor plates; and
a fifth capacitor plate embedded inside the isolation barrier, the fifth capacitor plate arranged in between the first and third capacitor plates, such that the first, second, third, fourth and fifth capacitor plates operate in a cascaded series capacitance mode.

### Claim 18 (depends on 17)

The device of claim 17, further comprising:
a first flip-chip die mounted at a first location on a major surface of the isolation barrier with a first terminal of the first flip-chip die bonded to a first bonding pad connected to the second capacitor plate embedded inside the isolation barrier.

### Claim 19 (depends on 18)

The device of claim 18, further comprising:
a second flip-chip die mounted at a second location on the major surface of the isolation barrier with a first terminal of the second flip-chip die bonded to a second bonding pad connected to the third capacitor plate embedded inside the isolation barrier.

### Claim 20 (depends on 18)

The device of claim 18, further comprising:
an externally-accessible pin of the device; and
a metallic track connecting one end of the externally-accessible pin to at least one pin of the first flip-chip die.