# US 2013/0154062 A1 · Die Structure and Method of Fabrication Thereof

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- Number: US 2013/0154062 A1
- Document ID: US20130154062A1
- Status: Published application
- Kind: A1
- Application number: 13/328,746
- Filed: 2011-12-16
- Published: 2013-06-20
- Earliest claimed: 2011-12-16
- Assignees: Taiwan Semiconductor Manufacturing Company, Ltd.
- Inventors: Jing-Cheng Lin; Ying-Da Wang; Li-Chung Kuo; Szu Wei Lu
- Web page: https://patentgrep.com/patent/US20130154062A1

## CPC

- H10W 74/012: {of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills}
- H10W 74/117: {the substrate having spherical bumps for external connection}
- H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills
- H10W 72/0198: {batch processes}
- H10W 72/072: {of bump connectors}
- H10W 72/073: {of die-attach connectors}
- H10W 72/248: {Top-view layouts, e.g. mirror arrays}
- H10W 72/29: Bond pads specially adapted therefor
- H10W 72/942: {relative to underlying supporting features, e.g. bond pads, RDLs or vias}
- H10W 72/944: {Dispositions of multiple bond pads}
- H10W 74/00: Encapsulations, e.g. protective coatings
- H10W 74/014: {using batch processing}
- H10W 74/142: {the encapsulations exposing the passive side of the semiconductor body}
- H10W 90/722: {between stacked chips}
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/732: {between stacked chips}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A die having a ledge along a sidewall, and a method of forming the die, is provided. A method of packaging the die is also provided. A substrate, such as a processed wafer, is diced by forming a first notch having a first width, and then forming a second notch within the first notch such that the second notch has a second width less than the first width. The second notch extends through the substrate, thereby dicing the substrate. The difference in widths between the first width and the second width results in a ledge along the sidewalls of the dice. The dice may be placed on a substrate, e.g., an interposer, and underfill placed between the dice and the substrate. The ledge prevents or reduces the distance the underfill is drawn up between adjacent dice. A molding compound may be formed over the substrate.

## Claims

### Claim 1

A method comprising:
providing a substrate;
forming a first notch between a first region and a second region, the first notch having a first width;
forming a second notch within the first notch, the second notch having a second width less than the first width, thereby forming a ledge, the second notch extending through the substrate, thereby dicing the substrate into separate dice;
placing one or more of the dice onto a second substrate such that the ledge is opposite the second substrate; and
placing an underfill between the one or more of the dice and the second substrate, an upper surface of the underfill being at the ledge.

### Claim 2 (depends on 1)

The method of claim 1, further comprising placing the substrate on a carrier tape prior to forming the second notch.

### Claim 3 (depends on 2)

The method of claim 2, wherein the substrate is attached to the carrier tape via conductive bumps.

### Claim 4

(canceled)

### Claim 5 (depends on 1)

The method of claim 1, wherein the second substrate comprises an interposer.

### Claim 6 (depends on 1)

The method of claim 1, further comprising forming a molding compound over the underfill between adjacent dice.

### Claim 7 (depends on 6)

The method of claim 6, further comprising thinning the molding compound.

### Claim 8 (depends on 1)

The method of claim 1, wherein the ledge has a width of about 5 μm to about 200 μm.

### Claim 9

A method comprising:
placing a plurality of dice on a substrate, at least one of the dice having a ledge formed along a sidewall;
placing an underfill between the plurality of dice and the substrate, the underfill extending between adjacent ones of the plurality of dice, the underfill not extending above the ledge; and
placing a molding compound over the underfill between the adjacent ones of the plurality of dice.

### Claim 10 (depends on 9)

The method of claim 9, further comprising separating the substrate into multiple components, at least one of the multiple components having a two or more dice.

### Claim 11 (depends on 9)

The method of claim 9, wherein the ledge has a width of about 5 μm to about 200 μm.

### Claim 12 (depends on 9)

The method of claim 9, further comprising thinning the molding compound, thereby exposing at least one of the plurality of dice.

### Claim 13

A device comprising:
a substrate;
a plurality of dice on the substrate, at least a first die of the plurality of dice having a ledge along a sidewall;
an underfill between the plurality of dice and the substrate, an upper surface of the ledge being free of the underfill; and
a molding compound between adjacent ones of the plurality of dice, the underfill extending between the molding compound and the substrate between the adjacent ones of the plurality of dice.

### Claim 14 (depends on 13)

The device of claim 13, wherein the ledge has a width of about 5 μm to about 200 μm.

### Claim 15 (depends on 13)

The device of claim 13, wherein an upper surface of at least one of the plurality of dice is exposed.

### Claim 16 (depends on 13)

The device of claim 13, wherein the substrate comprises an interposer.

### Claim 17 (depends on 16)

The device of claim 16, further comprising one or more through vias extending through the interposer.

### Claim 18 (depends on 13)

The device of claim 13, wherein a distance from an upper surface of the first die to the ledge is about 50 μm to about 700 μm.

### Claim 19 (depends on 13)

The device of claim 13, wherein an upper surface of the first die is exposed.

### Claim 20 (depends on 13)

The device of claim 13, wherein the underfill extends up to the ledge.