# US 2013/0154031 A1 · Integrally molded die and bezel structure for fingerprint sensors and the like > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2013/0154031 A1 - Document ID: US20130154031A1 - Status: Published application - Kind: A1 - Application number: 13/767,141 - Filed: 2013-02-14 - Published: 2013-06-20 - Earliest claimed: 2010-03-05 - Assignees: Apple Inc. - Inventors: ROBERT HENRY BOND; ALAN KRAMER; GIOVANNI GOZZINI - Web page: https://patentgrep.com/patent/US20130154031A1 ## CPC - G06V 40/1329: {Protecting the fingerprint sensor against damage caused by the finger} - G06V 40/1306: {non-optical, e.g. ultrasonic or capacitive sensing} - H10N 39/00: Integrated devices, or assemblies of multiple devices, comprising at least one piezoelectric, electrostrictive or magnetostrictive element covered by groups H10N30/00 – H10N35/00 - G06V: IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING - H10N: ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR ## Abstract A biometric sensor device, such as a fingerprint sensor, comprises a substrate to which is mounted a die on which is formed a sensor array and at least one conductive bezel. The die and the bezel are encased in a unitary encapsulation structure to protect those elements from mechanical, electrical, and environmental damage, yet with a portion of the sensor array and the bezel exposed or at most thinly covered by the encapsulation or other coating material structure. ## Claims ### Claim 1 A fingerprint sensor device, comprising: a substrate having a first side and a second side; a die having formed therein fingerprint sensing circuitry, said die secured to a die-receiving region of said first side of said substrate; a first conductive bezel secured to a first bezel-receiving region of said first side of said substrate proximate said die-receiving region; and an encapsulation structure integrally encasing at least a portion of said die and a portion of said first conductive bezel. ### Claim 2 (depends on 1) The fingerprint sensor of claim 1, wherein said encapsulation structure only partially encases said first conductive bezel such that at least a top surface of said first conductive bezel is not encased and is thereby exposed for physical contact or application of one or more layers thereover. ### Claim 3 (depends on 2) The fingerprint sensor of claim 2, wherein said die has formed on a surface thereof a sensor array for sensing a fingerprint pattern of a user, and wherein said encapsulation structure partially encases said die such that said sensor array is uncovered and exposed for physical contact. ### Claim 4 (depends on 3) The fingerprint sensor of claim 3, wherein said sensor array forms a component of a fingerprint strip sensor. ### Claim 5 (depends on 3) The fingerprint sensor of claim 3, wherein said sensor array forms a component of a fingerprint area sensor. ### Claim 6 (depends on 1) The fingerprint sensor of claim 1, wherein said encapsulation structure fully encases said die and first conductive bezel such that a top surface of each of said die and said first conductive bezel are encased by a portion of said encapsulation structure which is relatively much thinner that the remainder of said encapsulation structure. ### Claim 7 (depends on 6) The fingerprint sensor of claim 6, wherein said die has formed on a surface thereof a sensor array for capacitively sensing a fingerprint pattern of a user, and wherein said encapsulation structure encases said die such that said sensor array is thinly encased by said encapsulation structure such that the thickness of said encapsulation structure over said sensor array does not reduce the sensitivity of the sensor array in a manner that substantially prevents the possibility of said sensor array to capacitively sense a fingerprint of a finger in physical contact with said encapsulation structure over said sensor array. ### Claim 8 (depends on 7) The fingerprint sensor of claim 7, wherein said sensor array forms a component of a fingerprint strip sensor. ### Claim 9 (depends on 7) The fingerprint sensor of claim 7, wherein said sensor array forms a component of a fingerprint area sensor. ### Claim 10 (depends on 1) The fingerprint sensor of claim 1, further comprising: a second conductive bezel secured to a second bezel-receiving region of said first side of said substrate; wherein said encapsulation structure further substantially encloses said second conductive bezel integrally with said die and said first conductive bezel. ### Claim 11 (depends on 10) The fingerprint sensor of claim 10, wherein said first conductive bezel and said second conductive bezel form portions of a bezel frame, and further wherein said bezel frame is physically coupled to said substrate. ### Claim 12 (depends on 11) The fingerprint sensor of claim 11, wherein said bezel frame is electrically coupled to said die by way of said substrate. ### Claim 13 (depends on 1) The fingerprint sensor of claim 1, wherein said first conductive bezel is electrically coupled to said die by way of said substrate. ### Claim 14 (depends on 1) The fingerprint sensor of claim 1, wherein said bezel defines an opening in which said die is located such that said dies is surrounded by said bezel. ### Claim 15 (depends on 1) The fingerprint sensor of claim 1 in which said die has a top surface in a first plane, and said bezel has a top surface also in said first plane. ### Claim 16 (depends on 1) The fingerprint sensor of claim 1, wherein said die has a top surface substantially in a die plane and said bezel has a top surface such that said bezel top surface is substantially at, but not past, said die plane. ### Claim 17 (depends on 1) The fingerprint sensor of claim 1, wherein said first side of said substrate is in a first plane, said die has a top surface in a second plane, and said bezel has a top surface, and further in which said die and bezel are positioned relative to one another such that the distance between said first plane and said bezel top surface is greater than the distance between said first plane and said second plane. ### Claim 18 (depends on 17) The fingerprint sensor of claim 17, wherein said bezel top surface is convex. ### Claim 19 (depends on 1) The fingerprint sensor of claim 1, wherein said first conductive bezel has an arch-shaped side profile having a top surface and two attachment feet having attachment portions, said top surface and said attachment feet defining an interior region therebetween, and further wherein said encapsulation structure includes a portion thereof disposed in and substantially filling said interior region. ### Claim 20 A fingerprint sensor assembly comprising: a substrate having a first side and a second side; a die having formed thereon a fingerprint sensing array, said die secured to a die-receiving region of said first side of said substrate; a first conductive bezel secured to a first bezel-receiving region of said first side of said substrate proximate said die-receiving region; a second conductive bezel secured to a second bezel-receiving region of said first side of said substrate proximate said die-receiving region, such that said die receiving region is between said first and second bezel-receiving regions; and an encapsulation structure integrally encapsulating said die, said first conductive bezel, and said second conductive bezel, said encapsulation structure substantially encasing said die and said first and second conductive bezels such that only said fingerprint sensing array and a portion of a top surface of each of said first conductive bezel and said second conductive bezel are not encased by said encapsulation structure and are exposed for physical contact. ### Claim 21 (depends on 20) The fingerprint sensor of claim 20, wherein said first conductive bezel and said second conductive bezel are each electrically coupled to said die by way of said substrate.