# US 2013/0153935 A1 · Light Emitting Systems and Methods > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2013/0153935 A1 - Document ID: US20130153935A1 - Status: Published application - Kind: A1 - Application number: 13/332,342 - Filed: 2011-12-20 - Published: 2013-06-20 - Earliest claimed: 2011-12-20 - Inventors: Todd W. Hodrinsky; Donald T. Wesson, JR.; Deborah D. Cebry; Matthew D. Gidman; Robert M. Sarazin - Web page: https://patentgrep.com/patent/US20130153935A1 ## CPC - H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls - H10H 20/84: Coatings, e.g. passivation layers or antireflective coatings - H10H 20/034: {of coatings} - H10H 20/853: characterised by their shape - H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract Light-emitting systems and related methods of their fabrication are disclosed. ## Claims ### Claim 1 A light-emitting system comprising: at least one light-emitting device, said at least one light-emitting device comprising a p-doped region, an n-doped region, an active region disposed between said p-doped region and n-doped region, an n-contact layer disposed on the n-doped layer and a p-contact layer disposed on the p-doped layer; a carrier with conductive patterns disposed thereon forming a circuit for connecting to a power source for operating said at least one light-emitting device, said formed circuit being in electrical communication with the n-contact layer and p-contact layer of the light-emitting device; said at least one light-emitting device is mounted on said carrier with a non-conductive adhesive disposed on said carrier such that at least one of the p-contact layer and n-contact layer of the light-emitting device is in direct contact with said conductive patterns formed on said carrier; wherein said at least one light-emitting device is selected from the group consisting of light-emitting diode, surface mount device (SMD) package incorporating at least one light-emitting diode, integrated circuit incorporating at least one light-emitting diode, or a combination thereof. ### Claim 2 (depends on 1) The light-emitting system of claim 1 wherein said p-contact layer and said n-contact layer of said light-emitting device are disposed on the same side of the light-emitting device, on the side that is opposite the light emission surface of the light-emitting device. ### Claim 3 (depends on 1) The light-emitting system of claim 1 wherein said p-contact layer and said n-contact layer of said light-emitting device are disposed on the opposite sides of the light-emitting device. ### Claim 4 (depends on 1) The light-emitting system of claim 1 further comprising a transparent encapsulation layer. ### Claim 5 (depends on 1) The light-emitting system of claim 1 further comprising a light converting phosphor layer. ### Claim 6 (depends on 1) The light-emitting system of claim 1 wherein said non-conductive adhesive is disposed on the carrier in at least one spot on the perimeter of the light-emitting device. ### Claim 7 (depends on 6) The light-emitting system of claim 6 wherein said non-conductive adhesive is further disposed to fill in the gaps between said at least one light-emitting device and said carrier. ### Claim 8 (depends on 1) A method of making a light-emitting system in accordance with claim 1, said method comprising: providing at least one light-emitting device comprising a p-doped region, an n-doped region, an active region disposed between said p-doped region and n-doped region, an n-contact layer disposed on the n-doped layer and a p-contact layer disposed on the p-doped layer; providing a carrier with conductive patterns disposed thereon forming a circuit for connecting to a power source for operating said at least one light-emitting device; placing said at least one light-emitting device on the carrier in such a way as to make at least one of said p-contact layer and said n-contact layer in direct contact with the conductive patterns on the carrier; applying a non-conductive adhesive material on the carrier to attach the light-emitting device to the carrier; and curing said non-conductive adhesive material; wherein the at least one light-emitting device is selected from the group consisting of light-emitting diode, surface mount device (SMD) package incorporating at least one light-emitting diode, integrated circuit incorporating at least one light-emitting diode, or a combination thereof. ### Claim 9 (depends on 8) The method of claim 8 wherein said p-contact layer and said n-contact layer are disposed on the same side of the light-emitting device, on the side that is opposite the light emission surface of the light-emitting device. ### Claim 10 (depends on 8) The method of claim 8 wherein said p-contact layer and said n-contact layer are disposed on the opposite sides of the light-emitting device. ### Claim 11 (depends on 10) The method of claim 10 further comprising electrically connecting one of the p-contact and n-contact layer of the light emitting device to the conductive circuit on the carrier. ### Claim 12 (depends on 8) The method of claim 8 wherein applying said non-conductive adhesive material is in at least one spot on the perimeter of the light-emitting device. ### Claim 13 (depends on 8) The method of claim 8 further comprising disposing a transparent encapsulation layer. ### Claim 14 (depends on 8) The method of claim 8 further comprising disposing a light converting phosphor layer. ### Claim 15 (depends on 8) The method of claim 8 further comprising applying said non-conductive adhesive to fill in the gaps between said at least one light-emitting device and said carrier. ### Claim 16 (depends on 8) The method of claim 8 further comprising applying a downward force to the light-emitting device prior to dispensing the non-conductive adhesive. ### Claim 17 (depends on 8) The method of claim 8 further comprising lighting up the light-emitting device by applying voltage to said device prior to curing the non-conductive adhesive to test if the device is functional. ### Claim 18 (depends on 8) The method of claim 8 wherein dispensing the non-conductive adhesive on the carrier is conducted prior to placing the at least one light-emitting device on the carrier. ### Claim 19 (depends on 18) The method of claim 18 further comprising applying a downward force to the light-emitting device after placing the light-emitting device on the carrier. ### Claim 20 (depends on 19) The method of claim 19 wherein applying the downward force to the light-emitting device is further conducted while the adhesive is being cured.