# US 2013/0153932 A1 · Method for manufacturing photocoupler, and photocoupler lead frame sheet > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2013/0153932 A1 - Document ID: US20130153932A1 - Status: Published application - Kind: A1 - Application number: 13/475,704 - Filed: 2012-05-18 - Published: 2013-06-20 - Earliest claimed: 2011-12-16 - Assignees: Kabushiki Kaisha Toshiba - Inventors: Teruo Takeuchi; Atsushi Takeshita - Web page: https://patentgrep.com/patent/US20130153932A1 ## CPC - H10F 55/255: formed in, or on, a common substrate - H10F 77/50: Encapsulations or containers (for photovoltaic modules H10F19/80) - H10W 90/00: Package configurations - H10W 72/0198: {batch processes} - H10W 72/884: {Die-attach connectors and bond wires} - H10W 74/00: Encapsulations, e.g. protective coatings - H10W 90/736: {between a chip and a stacked lead frame, conducting package substrate or heat sink} - H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink} - H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A method for manufacturing a photocoupler includes: mounting light emitting devices and light receiving devices on a lead frame sheet; positioning the lead frame sheet with respect to a die by cutting off the one set of column portions from a linking portion and inserting a first pilot pin formed on the die into a second pilot hole; opposing the light emitting devices and the light receiving devices to each other; connecting the light emitting side coupling bars and the light receiving side coupling bars to each other on the die; forming a resin body so as to cover a pair of the light emitting device and the light receiving device; and cutting off the light emitting side lead frame portion from the light emitting column portion and cutting off the light receiving side lead frame portion from the light receiving column portion. ## Claims ### Claim 1 A method for manufacturing a photocoupler, comprising: mounting light emitting devices and light receiving devices on a lead frame sheet in which a plurality of light emitting column portions and a plurality of light receiving column portions are alternately arranged, the light emitting column portion including a plurality of light emitting side lead frame portions arranged in a line, the light emitting column portion being provided with three or more light emitting side coupling bars, the light receiving column portion including a plurality of light receiving side lead frame portions arranged in a line, the light receiving column portion being provided with three or more light receiving side coupling bars, one end of the light emitting column portions and one end of the light receiving column portions being interlinked by a linking portion, a first pilot hole being formed in each of one set of column portions of the light emitting column portions and the light receiving column portions, a second pilot hole being formed in a portion except the one set of column portions, the light emitting device being mounted on the light emitting side lead frame portion, and the light receiving device being mounted on the light receiving side lead frame portion; positioning the lead frame sheet with respect to a die by cutting off the one set of column portions from the linking portion and inserting a first pilot pin formed on the die into the second pilot hole; positioning the one set of column portions with respect to the die and opposing the light emitting devices and the light receiving devices to each other by inserting a second pilot pin formed on the die into the first pilot hole and stacking the light emitting side coupling bars and the light receiving side coupling bars; connecting the light emitting side coupling bars and the light receiving side coupling bars to each other on the die; forming a resin body so as to cover a pair of the light emitting device and the light receiving device; and cutting off the light emitting side lead frame portion from the light emitting column portion and cutting off the light receiving side lead frame portion from the light receiving column portion. ### Claim 2 (depends on 1) The method according to claim 1, wherein two of the three or more light emitting side coupling bars are placed in both longitudinal end portions of the light emitting column portion, and two of the three or more light receiving side coupling bars are placed in both longitudinal end portions of the light receiving column portion. ### Claim 3 (depends on 1) The method according to claim 1, wherein the light emitting side coupling bars are arranged at equal spacings along longitudinal direction of the light emitting column portion, and the light receiving side coupling bars are arranged at equal spacings along longitudinal direction of the light receiving column portion. ### Claim 4 (depends on 1) The method according to claim 1, wherein the light emitting side lead frame portion is provided with a light emitting device mounting portion with the light emitting device mounted thereon, and a light emitting side lead connected to the light emitting device mounting portion and extracted outside the resin body, the light receiving side lead frame portion is provided with a light receiving device mounting portion with the light receiving device mounted thereon, and a light receiving side lead connected to the light receiving device mounting portion and extracted outside the resin body, the light emitting side lead and the light receiving side lead are placed coplanarly, and the light emitting device mounting portion and the light receiving device mounting portion are displaced to one direction side in thickness direction of the lead frame sheet with respect to the light emitting side lead and the light receiving side lead. ### Claim 5 (depends on 4) The method according to claim 4, wherein the light emitting side coupling bar and the light receiving side coupling bar are displaced to the one direction side by a half distance of thickness of the lead frame sheet with respect to the light emitting side lead and the light receiving side lead. ### Claim 6 (depends on 1) The method according to claim 1, wherein phase of the light emitting side lead frame portions in the light emitting column portion and phase of the light receiving side lead frame portions in the light receiving column portion are different from each other. ### Claim 7 A photocoupler lead frame sheet comprising: a plurality of light emitting column portions and light receiving column portions arranged alternately; and a linking portion interlinking one end of the light emitting column portions and one end of the light receiving column portions, the light emitting column portion including: a plurality of light emitting side lead frame portions arranged in a line; and three or more light emitting side coupling bars, the light receiving column portion including: a plurality of light receiving side lead frame portions arranged in a line; and three or more light receiving side coupling bars, a first pilot hole being formed in one column portion of the light emitting column portion and the light receiving column portion, and a second pilot hole being formed in a portion except the one column portion. ### Claim 8 (depends on 7) The sheet according to claim 7, wherein two of the three or more light emitting side coupling bars are placed in both longitudinal end portions of the light emitting column portion, and two of the three or more light receiving side coupling bars are placed in both longitudinal end portions of the light receiving column portion. ### Claim 9 (depends on 7) The sheet according to claim 7, wherein the light emitting side coupling bars are arranged at equal spacings along longitudinal direction of the light emitting column portion, and the light receiving side coupling bars are arranged at equal spacings along longitudinal direction of the light receiving column portion. ### Claim 10 (depends on 7) The sheet according to claim 7, wherein the light emitting side lead frame portion including: a light emitting device mounting portion with a light emitting device to be mounted thereon; and a light emitting side lead connected to the light emitting device mounting portion, the light receiving side lead frame portion including: a light receiving device mounting portion with a light receiving device to be mounted thereon; and a light receiving side lead connected to the light receiving device mounting portion, the light emitting side lead and the light receiving side lead are placed coplanarly, and the light emitting device mounting portion and the light receiving device mounting portion are displaced to one direction side in thickness direction of the lead frame sheet with respect to the light emitting side lead and the light receiving side lead. ### Claim 11 (depends on 10) The sheet according to claim 10, wherein the light emitting side coupling bar and the light receiving side coupling bar are displaced to the one direction side by a half distance of thickness of the lead frame sheet with respect to the light emitting side lead and the light receiving side lead. ### Claim 12 (depends on 7) The sheet according to claim 7, further comprising: another linking portion interlinking the other end of the light emitting column portions and the other end of the light receiving column portions. ### Claim 13 (depends on 7) The sheet according to claim 7, wherein phase of the light emitting side lead frame portions in the light emitting column portion and phase of the light receiving side lead frame portions in the light receiving column portion are different from each other.