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US 2013/0153859 A1Published application
Semiconductor nanoparticle assembly
AssigneesTohoku University, Konica Minolta Medical & Graphic, Inc.
InventorsMasaru Takahashi, Kensaku Takanashi, Hideki Hoshino, Kohsuke Gonda, Motohiro Takeda, Noriaki Ohuchi
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Abstract
A semiconductor nanoparticle assembly including semiconductor nanoparticles having a core/shell structure, and wherein the semiconductor nanoparticles are bonded by means of amide bonds.
Claims4
A semiconductor nanoparticle assembly containing semiconductor nanoparticles each having a core/shell structure, wherein:
- the semiconductor particles are bonded with each other by amide bonding.
Dependencies are inferred from the claim text.