# US 2013/0153834 A1 · Liquid composition, and resistor film, resistor element and circuit board using same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2013/0153834 A1 - Document ID: US20130153834A1 - Status: Published application - Kind: A1 - Application number: 13/814,293 - Filed: 2011-08-04 - Published: 2013-06-20 - Earliest claimed: 2010-08-06 - Assignees: Hitachi Chemical Company, Ltd. - Inventors: Yasushi Kumashiro; Naoki Maruyama; Maki Inada - Web page: https://patentgrep.com/patent/US20130153834A1 ## CPC - C09D 11/324: containing carbon black - C08K 3/04: Carbon - C08K 3/041: {Carbon nanotubes} - C08K 5/1535: Five-membered rings - C09D 11/36: based on non-aqueous solvents - C09D 11/38: characterised by non-macromolecular additives other than solvents, pigments or dyes - C09D 11/52: Electrically conductive inks - H01B 1/24: the conductive material comprising carbon-silicon compounds, carbon or silicon - H01C 7/003: {Thick film resistors} - H01C 17/0652: {containing carbon or carbides} - H01C 17/06593: {characterised by the temporary binder} - H05K 1/167: {incorporating printed resistors} - B82Y 99/00: Subject matter not provided for in other groups of this subclass - C08K 2201/005: Additives being defined by their particle size in general - C08K 2201/011: Nanostructured additives - C08L 63/00: Compositions of epoxy resins; Compositions of derivatives of epoxy resins - H05K 2201/026: Nanotubes or nanowires - H05K 2201/0323: Carbon - Y10S 977/742: Carbon nanotubes, CNTs - C09D: COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR (cosmetics A61K; processes for applying liquids or other fluent materials to surfaces, in general, B05D; staining wood B27K5/02; glazes or vitreous enamels C03C; natural resins, French polish, drying-oils, driers, turpentine, per se, C09F; polishing compositions other than French polish, ski waxes C09G; adhesives or use of materials as adhesives C09J; materials for sealing or packing joints or covers C09K3/10; materials for stopping leaks C09K3/12; processes for the electrolytic or electrophoretic production of coatings C25D) - C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09) - H01B: CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES (selection for magnetic properties H01F1/00; waveguides H01P {; printed circuits H05K}) - H01C: RESISTORS - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - B82Y: SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES - C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06) - Y10S: TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS ## Abstract There is provided a liquid composition that can form a resistor exhibiting a stable resistance value. One mode of the liquid composition of the invention is a liquid composition comprising (a) an epoxy resin, (b) carbon black particles, (c) carbon nanotubes and (d) a solvent with a vapor pressure of less than 1.34×103 Pa at 25° C. ## Claims ### Claim 1 A liquid composition comprising (a) an epoxy resin, (b) carbon black particles, (c) carbon nanotubes and (d) a solvent with a vapor pressure of less than 1.34×103 Pa at 25° C. ### Claim 2 (depends on 1) The liquid composition according to claim 1, wherein the mean dispersion particle size of the (b) carbon black particles is no greater than 500 nm, and the maximum dispersion particle size is no greater than 2 μm. ### Claim 3 (depends on 1) The liquid composition according to claim 1, wherein the outer diameter of the (c) carbon nanotubes is 3 nm or greater and the length is 100 nm or greater. ### Claim 4 (depends on 1) The liquid composition according to claim 1, wherein the content of the (b) carbon black particles is 10 to 80 vol %, based on the total solid volume of the liquid composition. ### Claim 5 (depends on 1) The liquid composition according to claim 1, wherein the content of the (c) carbon nanotubes is 0.1 to 20 parts by mass with respect to 100 parts by solid mass of the (b) carbon black particles. ### Claim 6 (depends on 1) The liquid composition according to claim 1, wherein the viscosity is no greater than 50 mPa·s at 25° C. ### Claim 7 (depends on 1) The liquid composition according to claim 1, wherein the (a) epoxy resin is a glycidyl etherified condensation product of a phenol and an aldehyde. ### Claim 8 (depends on 1) The liquid composition according to claim 1, which further comprises (e) a curing agent, the (e) curing agent comprising the condensation product of a phenol and an aldehyde. ### Claim 9 A liquid composition comprising (a1) a diol with a molecular weight of 40 or greater and less than 1000 and/or a resin containing the diol as a backbone, and (b) carbon black particles. ### Claim 10 (depends on 9) The liquid composition according to claim 9, wherein the (a1) diol with a molecular weight of 40 or greater and less than 1000 and/or a resin containing the diol as a backbone includes (a2) an epoxy resin with a molecular weight of between 200 and 50,000, comprising a diol with a molecular weight of 40 or greater and less than 1000 in the backbone. ### Claim 11 (depends on 9) The liquid composition according to claim 9, which further comprises (d) a solvent with a vapor pressure of less than 1.34×103 Pa at 25° C., and (e) a curing agent. ### Claim 12 (depends on 11) The liquid composition according to claim 11, wherein the (e) curing agent comprises the condensation product of a phenol and an aldehyde. ### Claim 13 (depends on 9) The liquid composition according to claim 9, wherein the mean dispersion particle size of the (b) carbon black particles is no greater than 500 nm, and the maximum dispersion particle size is no greater than 2 μm. ### Claim 14 (depends on 9) The liquid composition according to claim 9, wherein the content of the (b) carbon black particles is 10 to 80 vol %, based on the total solid volume of the liquid composition. ### Claim 15 (depends on 9) The liquid composition according to claim 9, wherein the viscosity is no greater than 50 mPa·s at 25° C. ### Claim 16 (depends on 9) The liquid composition according to claim 9, which further comprises (c) carbon nanotubes. ### Claim 17 (depends on 16) The liquid composition according to claim 16, wherein the outer diameter of the (c) carbon nanotubes is 3 nm or greater and the length is 100 nm or greater. ### Claim 18 (depends on 16) The liquid composition according to claim 16, wherein the content of the (c) carbon nanotubes is 0.1 to 20 parts by mass with respect to 100 parts by solid mass of the (b) carbon black particles. ### Claim 19 (depends on 1) A resistor film formed by removing the solvent from the liquid composition according to claim 1 by heating. ### Claim 20 (depends on 1) A resistor film formed by printing or coating the liquid composition according to claim 1 on a substrate to form a film of the liquid composition, and removing the solvent from the film of the liquid composition by heating. ### Claim 21 (depends on 19) A resistor element having the resistor film according to claim 19. ### Claim 22 (depends on 21) A circuit board having the resistor element according to claim 21 formed on a substrate. ### Claim 23 (depends on 20) A resistor element having the resistor film according to claim 20. ### Claim 24 (depends on 23) A circuit board having the resistor element according to claim 23 formed on a substrate. ### Claim 25 (depends on 9) A resistor film formed by removing the solvent from the liquid composition according to claim 9 by heating. ### Claim 26 (depends on 9) A resistor film formed by printing or coating the liquid composition according to claim 9 on a substrate to form a film of the liquid composition, and removing the solvent from the film of the liquid composition by heating. ### Claim 27 (depends on 25) A resistor element having the resistor film according to claim 25. ### Claim 28 (depends on 27) A circuit board having the resistor element according to claim 27 formed on a substrate. ### Claim 29 (depends on 26) A resistor element having the resistor film according to claim 26. ### Claim 30 (depends on 29) A circuit board having the resistor element according to claim 29 formed on a substrate.