# US 2013/0153643 A1 · Polyamide composition for surface-mounted components

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- Number: US 2013/0153643 A1
- Document ID: US20130153643A1
- Status: Published application
- Kind: A1
- Application number: 13/806,702
- Filed: 2011-06-21
- Published: 2013-06-20
- Earliest claimed: 2010-06-22
- Assignees: Rhodia Operations
- Inventors: Stéphane Jeol
- Web page: https://patentgrep.com/patent/US20130153643A1

## CPC

- C08L 77/00: Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain (of polyhydrazides C08L79/06; of polyamideimides or polyamide acids C08L79/08); Compositions of derivatives of such polymers
- C08K 5/49: Phosphorus-containing compounds {(C08K5/0091 takes precedence)}
- C08L 77/06: Polyamides derived from polyamines and polycarboxylic acids (C08L77/10 takes precedence)
- C09K 21/04: containing phosphorus
- C09K 21/08: containing halogen
- C09K 21/10: containing nitrogen
- C09K 21/12: containing phosphorus
- C08K 5/5313: Phosphinic compounds, e.g. R2=P(:O)OR'
- C08K 7/14: Glass
- C08L 2205/02: containing two or more polymers of the same C08L -group
- H05K 3/341: Surface mounted components
- C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06)
- C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09)
- C09K: MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

A polyamide composition for surface-mounted components is described. Also described are compositions for surface-mounted components (SMCs) including a semiaromatic polyamide modified by a hydroxyaromatic compound, reinforcing fillers, and a flame retardant. Further, the compositions have many advantages linked to the uses thereof in lead-free reflow soldering processes, in particular a good dimensional stability and a blistering resistance during the use of articles produced from these compositions.

## Claims

### Claim 1

A component for surface mounting obtained at least from a composition comprising at least a semiaromatic polyamide modified by an aromatic hydroxyl compound, a reinforcing filler glom; and a flame retardant.

### Claim 2 (depends on 1)

The component as defined in claim 1, wherein 5 mol % to 50 mol % of the monomers used in the semiaromatic polyamide are monomers comprising aromatic groups, including an aromatic hydroxyl compound.

### Claim 3 (depends on 1)

The component as defined in claim 1, wherein the polyamide is selected from the group consisting of: polyamide 6T, polyamide 66/6T, polyamide 61, polyamide 66/61, polyamide 6T/61, copolyamide
6/6T of differing molar compositions and blends thereof.

### Claim 4 (depends on 1)

The component as defined in claim 1, wherein the polyamide has a melting point of from 150° C. and 340° C.

### Claim 5 (depends on 1)

The component as defined in claim 1, wherein the composition comprises 30% to 75% by weight of polyamide, with respect to the total weight of the composition.

### Claim 6 (depends on 1)

The component as defined in claim 1, wherein the aromatic hydroxyl compound has at least one function that can react with the functions of the polyamide or the polyamide monomers.

### Claim 7 (depends on 1)

The component as defined in claim 1, wherein the aromatic hydroxyl compound is represented by the following formula (I):
(HO)x—Z—(F)n (I)
wherein:
Z is a multivalent aromatic or arylaliphatic hydrocarbon radical;
x is from 1 to 10;
F is an acid, aldehyde, amine or ketone function that can bond to an acid or amine function of the polyamide monomers; and
n is from 1 to 5.

### Claim 8 (depends on 7)

The component as defined in claim 7, wherein Z is a multivalent radical selected from the group consisting of: a benzene, a methylbenzene, a naphthalene, a biphenyl, a diphenyl ether, a diphenyl sulfide, a diphenyl sulfone, a ditolyl ether, a xylylene, a diethylbenzene and a pyridine.

### Claim 9 (depends on 1)

The component as defined in claim 1, wherein the aromatic hydroxyl compound is selected from the group consisting of: a 2-hydroxyterephthalic acid, a 5-hydroxyisophthalic acid, a 4-hydroxyisophthalic acid, a 2,5-dihydroxyterephthalic acid, a 4-hydroxyphenylacetic acid or a gallic acid, a L-tyrosine, a 4-hydroxyphenylacetic acid, a 3,5-diaminophenol, a 5-hydroxy-m-xylylenediamine, a 3-aminophenol, a 3-amino-4-methylphenol and a 3-hydroxy-5-aminobenzoic acid.

### Claim 10 (depends on 1)

The component as defined in claim 1, wherein the reinforcing filler is a fibrous filler selected from the group consisting of a glass fiber, a carbon fiber, a natural fiber, an aramid fiber, a nanotube hemp and flax.

### Claim 11 (depends on 1)

The component as defined in claim 1, wherein the composition comprises 15% to 50% by weight of reinforcing filler, with respect to the total weight of the composition.

### Claim 12 (depends on 1)

The component as defined in claim 1, wherein the flame retardant is comprised of phosphorus and is selected from the group consisting of: a phosphine oxide, a phosphonic acid or a salt thereof, a phosphinic acid or a salt thereof, a cyclic phosphonate, an organic phosphate, an inorganic phosphate, and a red phosphorus.

### Claim 13 (depends on 1)

The component as defined in claim 1, wherein the flame retardant is an organic nitrogen flame retardant selected from the group consisting of: a triazine, a cyanuric acid, an isocyanuric acid, a melamine, a melamine oxalate, a phthalate, a borate, a sulfate, a phosphate, a polyphosphate, a pyrophosphate, a condensed melamine product, a tris(hydroxyethyl) isocyanurate, a benzoguanamine, a guanidine, an allantoin, and a glycoluril.

### Claim 14 (depends on 1)

The component as defined in claim 1, wherein the flame retardant is a flame retardant comprising brominated derivative selected from the group consisting of: a PBDPO (a polybromodiphenyl oxide), a BrPS (a brominated polystyrene and polybromostyrene), poly(pentabromobenzyl acrylate), brominated indane, tetradecabromodiphenoxybenzene, 1,2-bis(pentabromophenyl)ethane, tetrabromobisphenol A and a brominated epoxy oligomer.

### Claim 15 (depends on 1)

The component as defined in claim 1, wherein the composition comprises 5% to 40% by weight of flame retardants, with respect to the total weight of the composition.

### Claim 16 (depends on 1)

A process for assembling a component as defined in claim 1 on a surface, the process comprising, soldering and/or brazing.