# US 2013/0153413 A1 · Sputter gun shutter > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2013/0153413 A1 - Document ID: US20130153413A1 - Status: Published application - Kind: A1 - Application number: 13/327,281 - Filed: 2011-12-15 - Published: 2013-06-20 - Earliest claimed: 2011-12-15 - Assignees: Intermolecular, Inc. - Inventors: Hong Sheng Yang; Hien Min Huu Le; Xuena Zhang - Web page: https://patentgrep.com/patent/US20130153413A1 ## CPC - C23C 14/35: by application of a magnetic field, e.g. magnetron sputtering {(C23C14/3457 takes precedence)} - C23C 14/042: {using masks} - C23C 14/351: {using a magnetic field in close vicinity to the substrate} - C23C 14/352: {using more than one target (C23C14/56 takes precedence)} - C23C 14/505: {for rotation of the substrates} - C23C 14/542: {Controlling the film thickness or evaporation rate} - C23C 14/564: {Means for minimising impurities in the coating chamber such as dust, moisture, residual gases} - H01J 37/34: operating with cathodic sputtering (H01J37/36 takes precedence {; methods of cathodic sputtering C23C14/34}) - H01J 37/3405: {Magnetron sputtering} - H01J 37/3447: {Collimators, shutters, apertures} - C23C: COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion B21C23/22; covering with metal by connecting pre-existing layers to articles, see the relevant places, e.g. B21D39/00, B23K; metallising of glass C03C; metallising mortars, concrete, artificial stone, ceramics or natural stone C04B41/00; enamelling of, or applying a vitreous layer to, metals C23D; treating metal surfaces or coating of metals by electrolysis or electrophoresis C25D; single-crystal film growth C30B; by metallising textiles D06M11/83; decorating textiles by locally metallising D06Q1/04) - H01J: ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS (spark-gaps H01T; electric arc lamps H05B31/00; particle accelerators H05H) ## Abstract In some embodiments of the present invention, a gun shutter is provided that comprises a gun shutter lip that aligns with a grounded shield lip to form a gap. The gap is operable to prevent contamination from other sputter guns present in the chamber. Additionally, the gun shutter is spaced apart from the face of the target so that a stable plasma may be ignited and maintained between the face of the target and the gun shutter. This allows the gun shutter to be used as a burn-in or conditioning shield and allows the elimination of other shields, thus lowering the size, complexity, and cost of the chamber. ## Claims ### Claim 1 A shutter for a sputter gun comprising: a bottom plate having a planar surface, a peripheral edge, and a central axis, wherein the central axis is perpendicular to the planar surface; a side wall having an upper edge and a lower edge, wherein the lower edge of the side wall is attached at the peripheral edge of the bottom plate; and a first lip formed at the upper edge of the side wall, wherein the lip extends toward the central axis of the bottom plate. ### Claim 2 (depends on 1) The shutter of claim 1 wherein the first lip is further aligned with a second lip disposed on a grounded shield to form a gap. ### Claim 3 (depends on 2) The shutter of claim 2 wherein the gap is between about 0.5 mm and about 5 mm. ### Claim 4 (depends on 1) The shutter of claim 1 wherein length the first lip in a direction toward the central axis of the bottom plate is between about 10 mm and about 50 mm. ### Claim 5 (depends on 1) The shutter of claim 1 wherein a distance from the bottom plate to a target face is between about 10 mm and about 50 mm. ### Claim 6 (depends on 1) The shutter of claim 1 wherein the shutter is further connected to a shaft, wherein the shaft is operable to rotate the shutter in front of a sputter target. ### Claim 7 A sputter gun comprising: a magnetron; a target disposed adjacent to the magnetron, the target having a central axis and a periphery; a grounded shield having a lower edge, the grounded shield disposed around the periphery of the target, wherein the grounded shield further comprises a first lip formed at the lower edge of the grounded shield, wherein the first lip extends in a direction toward the central axis of the target; and a shutter, the shutter comprising: a bottom plate having a planar surface, a peripheral edge, and a central axis, wherein the central axis is perpendicular to the planar surface; a side wall having an upper edge and a lower edge, wherein the lower edge of the side wall is attached at the peripheral edge of the bottom plate; and a second lip formed at the upper edge of the side wall, wherein the lip extends toward the central axis of the bottom plate. ### Claim 8 (depends on 1) The sputter gun of claim 1 wherein the first lip of the grounded shield is aligned with the second lip of the shutter to form a gap. ### Claim 9 (depends on 8) The sputter gun of claim 8 wherein the gap is between about 0.5 mm and about 5 mm. ### Claim 10 (depends on 1) The sputter gun of claim 1 wherein length the second lip in a direction toward the central axis of the bottom plate is between about 10 mm and about 50 mm. ### Claim 11 (depends on 1) The sputter gun of claim 1 wherein a distance from the bottom plate to a target face is between about 10 mm and about 50 mm. ### Claim 12 (depends on 1) The sputter gun of claim 1 wherein the shutter is further connected to a shaft, wherein the shaft is operable to rotate the shutter in front of a sputter target.