# US 2013/0153294 A1 · Conductive path structure and wire harness

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 2013/0153294 A1
- Document ID: US20130153294A1
- Status: Published application
- Kind: A1
- Application number: 13/819,118
- Filed: 2011-09-16
- Published: 2013-06-20
- Earliest claimed: 2010-09-16
- Assignees: Yazaki Corporation
- Inventors: Hideomi Adachi; Hidehiko Kuboshima
- Web page: https://patentgrep.com/patent/US20130153294A1

## CPC

- H01R 3/00: Electrically-conductive connections not otherwise provided for
- B60K 28/14: responsive to accident or emergency, e.g. deceleration, tilt of vehicle
- H01B 7/328: {comprising violation sensing means}
- B60K 2028/006: {disconnecting the electric power supply, e.g. the vehicle battery}
- H01R: ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- B60K: ARRANGEMENT OR MOUNTING OF PROPULSION UNITS OR OF TRANSMISSIONS IN VEHICLES; ARRANGEMENT OR MOUNTING OF PLURAL DIVERSE PRIME-MOVERS IN VEHICLES; AUXILIARY DRIVES FOR VEHICLES; INSTRUMENTATION OR DASHBOARDS FOR VEHICLES; ARRANGEMENTS IN CONNECTION WITH COOLING, AIR INTAKE, GAS EXHAUST OR FUEL SUPPLY OF PROPULSION UNITS IN VEHICLES
- H01B: CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES (selection for magnetic properties H01F1/00; waveguides H01P {; printed circuits H05K})

## Abstract

A conductive path structure includes a conductor that includes a first conductive portion and a second conductive portion which are connected to each other through a cut-off facilitating portion, and a semi-solid state insulation member that is in a semi-solid state and covers the cut-off facilitating portion. When the cut-off facilitating portion is cut off so as to separate the first conductive portion and the second conductive portion to each other due to an impact applied to the cut-off facilitating portion, the semi-solid state insulation member covers end portions of the separated first conductive portion and the separated second conductive portion which are close to the cut-out facilitating portion.

## Claims

### Claim 1

A conductive path structure comprising:
a conductor that includes a first conductive portion and a second conductive portion which are connected to each other through a cut-off facilitating portion; and
a semi-solid state insulation member that is in a semi-solid state and covers the cut-off facilitating portion,
wherein when the cut-off facilitating portion is cut off so as to separate the first conductive portion and the second conductive portion to each other due to an impact applied to the cut-off facilitating portion, the semi-solid state insulation member covers end portions of the separated first conductive portion and the separated second conductive portion which are close to the cut-out facilitating portion.

### Claim 2 (depends on 1)

The conductive path structure according to claim 1, wherein the cut-off facilitating portion is a conductive portion of the conductor on which a groove is formed.

### Claim 3 (depends on 1)

The conductive path structure according to claim 1, wherein the cut-off facilitating portion is a conductive portion of the conductor on which a notch is formed.

### Claim 4 (depends on 1)

The conductive path structure according to claim 1, wherein the cut-off facilitating portion is a conductive portion of the conductor in which a through hole is formed.

### Claim 5 (depends on 1)

The conductive path structure according to claim 1, wherein the cut-off facilitating portion is a conductive portion of the conductor having a thin portion thinner than the first and second conductive portions.

### Claim 6 (depends on 1)

A wire harness including a plurality of conductive paths each having the conductive path structure according to claim 1.
