# US 2013/0153286 A1 · Shielding system for mobile device and method for assembling the system > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2013/0153286 A1 - Document ID: US20130153286A1 - Status: Published application - Kind: A1 - Application number: 13/710,956 - Filed: 2012-12-11 - Published: 2013-06-20 - Earliest claimed: 2011-12-16 - Assignees: Samsung Electronics Co., Ltd. - Inventors: Jeongung KIM; Jaewoo JEONG; Kuntak KIM; Hyunjoo HAN; Seyoung JANG - Web page: https://patentgrep.com/patent/US20130153286A1 ## CPC - H05K 9/0007: {Casings (standardised racks H05K9/0062)} - H05K 3/00: Apparatus or processes for manufacturing printed circuits - H05K 9/0028: {with retainers or specific soldering features} - Y10T 29/49124: On flat or curved insulated base, e.g., printed circuit, etc. - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract A shielding system for a mobile device and a method for assembling the system are provided. The shielding system includes a Printed Circuit Board (PCB) with a first area and a thickness, and a shield enclosure, spaced apart and above a front side of the PCB at a certain distance, for enclosing components on the PCB. Parts of the shield enclosure are coupled to at least one of a lateral side and a back side of the PCB. ## Claims ### Claim 1 A shielding system for a mobile device, the system comprising: a Printed Circuit Board (PCB) with a first area and a thickness; and a shield enclosure, spaced apart and above a front side of the PCB at a certain distance, for enclosing components on the PCB, wherein parts of the shield enclosure are coupled to at least one of a lateral side and a back side of the PCB. ### Claim 2 (depends on 1) The system of claim 1, wherein the shield enclosure comprises: a cover with a second area; a supporting lead for contacting the front side of the PCB, wherein the supporting lead comprises side walls extending from an edge of the cover; and a fixing lead, extending from the edge of the cover, for contacting and being fixed to at least one of the lateral side and the back side of the PCB. ### Claim 3 (depends on 2) The system of claim 2, wherein the fixing lead extends perpendicularly from the edge of the corner. ### Claim 4 (depends on 3) The system of claim 3, further comprising: one or more grooves, formed on the front side of the PCB, for receiving the supporting lead. ### Claim 5 (depends on 3) The system of claim 3, further comprising: one or more lead placement grooves, located on the lateral side of the PCB, for receiving the fixing lead. ### Claim 6 (depends on 5) The system of claim 5, further comprising: a soldering pad, located in the lead placement groove, for coupling the fixing lead to the lead placement groove. ### Claim 7 (depends on 6) The system of claim 6, wherein a reflow process is used to couple the fixing lead to the lead placement groove using the soldering pad. ### Claim 8 (depends on 3) The system of claim 3, further comprising: a hook located at the end of the fixing lead in such a way that it is bent toward the back side of the PCB; or a bent part formed at the end of the fixing lead in such a way that it is bent toward the back side of the PCB, perpendicular to the fixing lead. ### Claim 9 (depends on 8) The system of claim 8, further comprising: a soldering pad on the back side of the PCB, corresponding to an area where the hook approaches the back side of the PCB. ### Claim 10 (depends on 8) The system of claim 8, further comprising: a locking groove, formed on at least one side of the back side of the PCB, for receiving the bent part. ### Claim 11 (depends on 10) The system of claim 10, further comprising: a soldering pad, located in the locking groove, for coupling the bent part to the locking groove. ### Claim 12 (depends on 11) The system of claim 11, wherein a reflow process is used to couple the bent part to the locking groove using the soldering pad. ### Claim 13 (depends on 3) The system of claim 3, further comprising: a slot unit, placed on the front side of the PCB, for receiving the supporting lead. ### Claim 14 A method for assembling a shielding system, the method comprising: providing a Printed Circuit Board (PCB); providing a shield enclosure that comprises a cover, above the PCB, and a fixing lead extending from the cover; and fixing the fixing lead of the shield enclosure to at least one of a lateral side and a back side of the PCB. ### Claim 15 (depends on 14) The method of claim 14, wherein the fixing of the fixing lead of the shield enclosure to the at least one of the lateral side and the back side of the PCB comprises: forming at least one of a lead placement groove, formed on the lateral side of the PCB at a location corresponding to the fixing lead, and a bent part formed at the end of the fixing lead in such a way that it is bent toward the back side of the PCB; placing a pad with a soldering material in at least one of the lead placement groove and a location on the back side of the PCB corresponding to the bent part; arranging the shield enclosure with the fixing lead to at least one of the lead placement groove and the location on the back side of the PCB corresponding to the bent part; and fixing the fixing lead to the at least one of the lead placement groove and the location on the back side of the PCB corresponding to the bent part. ### Claim 16 (depends on 15) The method of claim 15, wherein the fixing of the fixing lead comprises using a solder reflow process to couple the fixing lead to the at least one of the lead placement groove and the location on the back side of the PCB corresponding to the bent part. ### Claim 17 (depends on 14) The method of claim 14, wherein the providing of the shield enclosure comprises at least one of the following: forming a fixing lead perpendicularly extending from the cover; forming a hook at the end of the fixing lead in such a way that it is bent toward the back side of the PCB and contacts the back side of the PCB; and forming a bent part at the end of the fixing lead in such a way that it is bent toward the back side of the PCB, perpendicular to the fixing lead. ### Claim 18 (depends on 14) The method of claim 14, further comprising: forming one or more grooves each of which has a certain depth and an area on a front side of the PCB; and placing supporting leads, extending parallel to the fixing lead and the cover of the shield enclosure, into the grooves. ### Claim 19 (depends on 14) The method of claim 14, further comprising: placing one or more slot units on a front side of the PCB; and fitting supporting leads, extending parallel to the fixing lead and the cover of the shield enclosure, into the slot units via an external force.