# US 2013/0153284 A1 · Lead Frame Package Structure with Low Electromagnetic Interference

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- Number: US 2013/0153284 A1
- Document ID: US20130153284A1
- Status: Published application
- Kind: A1
- Application number: 13/414,732
- Filed: 2012-03-08
- Published: 2013-06-20
- Earliest claimed: 2011-12-14
- Assignees: Novatek Microelectronics Corp.
- Inventors: Yu-Chang Pai
- Web page: https://patentgrep.com/patent/US20130153284A1

## CPC

- H10W 70/427: {Bent parts}
- H10W 70/027: {Mechanical treatments, e.g. deforming, punching or cutting}
- H10W 72/5522: {comprising gold [Au]}
- H10W 72/884: {Die-attach connectors and bond wires}
- H10W 90/736: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A lead frame package structure with low EMI includes at least a die holder each for supporting a die, and at least a lead frame each including a first terminal for connecting a printed circuit board, a second terminal for connecting the die, and a lead for connecting the first terminal and the second terminal, wherein the height of the lead is lower than the height of the first terminal and the second terminal.

## Claims

### Claim 1

A lead frame package structure with low EMI, comprising:
at least one die holder, for supporting a die; and
at least one lead frame, each including a first terminal for connecting a printed circuit board, a second terminal for connecting the die, and a lead for connecting the first terminal and the second terminal;
wherein, a height of the lead is lower than a height of the first terminal and a height of the second terminal.

### Claim 2 (depends on 1)

The lead frame package structure of claim 1, wherein the height of the lead that lower than the heights of the first terminal and the second terminal is formed via a stamping process.

### Claim 3 (depends on 1)

The lead frame package structure of claim 1, wherein the first terminal is a Gull-Wing pin.

### Claim 4 (depends on 1)

The lead frame package structure of claim 1, wherein the second terminal connects to the die via soldering.