# US 2013/0153282 A1 · Printed circuit board > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2013/0153282 A1 - Document ID: US20130153282A1 - Status: Published application - Kind: A1 - Application number: 13/529,580 - Filed: 2012-06-21 - Published: 2013-06-20 - Earliest claimed: 2011-12-20 - Assignees: Msi Computer (Shenzhen) Co., Ltd. - Inventors: Yi-Yen CHIANG - Web page: https://patentgrep.com/patent/US20130153282A1 ## CPC - H05K 1/116: {Lands, clearance holes or other lay-out details concerning the surrounding of a via} - H05K 3/3447: Lead-in-hole components - H05K 3/3452: Solder masks - H05K 2201/09436: Pads or lands on permanent coating which covers the other conductors - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract A printed circuit board including a board, a plating layer and a solder mask layer is provided. The board has a plated through hole for inserting a termination into the board. The plated through hole passes through a surface of the board. An annual ring around the plated through hole covers the surface of the board. The plating layer is formed in the plated through hole and electrically connected to the annual ring. The solder mask layer covers the surface of the board and a portion of the outer circle of the annual ring. The plated through hole and other portion of the outer circle of the annual ring are exposed in an opening of the solder mask layer. ## Claims ### Claim 1 A printed circuit board, comprising: a board having a plated through hole for inserting a termination into the board, wherein the plated through hole passes through a surface of the board, and an annual ring around the plated through hole covers the surface of the board; a plating layer formed in the plated through hole and electrically connected to the annual ring; and a solder mask layer covering the surface of the board and a portion of an outer circle of the annual ring, wherein the plated through hole and other portion of the outer circle of the annual ring are exposed in an opening of the solder mask layer. ### Claim 2 (depends on 1) The printed circuit board according to claim 1, wherein the opening of the solder mask layer further exposes a portion of the surface around the outside circle of the annual ring. ### Claim 3 (depends on 2) The printed circuit board according to claim 2, wherein the portion of the outside circle of the annual ring covered by the solder mask layer forms a covering portion, the other portion of the outside circle of the annual ring exposed in the opening forms two exposing portions, and the covering portion is interposed between two exposing portions disposed at two lateral sides of the covering portion. ### Claim 4 (depends on 3) The printed circuit board according to claim 3, wherein a portion of the surface around the outside circle of the annual ring exposed in the opening forms two opening aligning portions, and the covering portion is interposed between the two opening aligning portions disposed at two lateral sides of the covering portion. ### Claim 5 (depends on 3) The printed circuit board according to claim 3, wherein a margin of the covering portion in the radial direction of the annual ring is about a half of a margin of the annual ring. ### Claim 6 (depends on 4) The printed circuit board according to claim 4, wherein margins of the two opening aligning portions in the radial direction of the annual ring are about a half of a margin of the annual ring. ### Claim 7 (depends on 4) The printed circuit board according to claim 4, wherein margins of the opening aligning portions in the radial direction of the annual ring are equivalent to a maximum tolerance of the annual ring with respect to the misregistration of the solder mask layer. ### Claim 8 (depends on 1) The printed circuit board according to claim 1, wherein the outside circle of the annual ring is divided by the solder mask layer into several covering portions at an equal distance, and the outside circle of the annual ring is divided by the opening into several exposing portions at an equal distance, and the covering portions and the exposing portions are disposed in alternating sequence. ### Claim 9 (depends on 8) The printed circuit board according to claim 8, wherein each covering portion and each exposing portion respectively occupy 1/4˜1/16 of the circumference of the outside circle of the annual ring. ### Claim 10 (depends on 8) The printed circuit board according to claim 8, wherein when the quantity of the covering portions is four and the quantity of the exposing portions is also four, each covering portion and each exposing portion respectively occupy 1/6˜1/8 of the circumference of the outside circle of the annual ring. ### Claim 11 (depends on 8) The printed circuit board according to claim 8, further comprising a solder, wherein the termination is fixed in the plated through hole and electrically connected to the annual ring by the solder. ### Claim 12 A printed circuit board, comprising: a board having a first plated through hole and a second plated through hole for inserting two terminations into the board, wherein the first and the second plated through holes respectively pass through a surface of the board, and a first and a second annual rings around the first and the second plated through holes respectively cover the surface of the board; a plating layer formed in the first and the second plated through holes and electrically connected to the first and the second annual rings respectively; and a solder mask layer covering the surface of the board and a portion of the outer circles of the first and the second annual rings, wherein the first plated through hole and other portion of the outer circle of the first annual ring are exposed in a first opening of the solder mask layer, and the second plated through hole and other portion of the outer circle of the second annual ring are exposed in a second opening of the solder mask layer. ### Claim 13 (depends on 12) The printed circuit board according to claim 12, wherein the first opening of the solder mask layer further exposes a portion of the surface around the outside circle of the first annual ring, and the second opening of the solder mask layer further exposes a portion of the surface around the outside circle of the second annual ring. ### Claim 14 (depends on 13) The printed circuit board according to claim 13, wherein the portions of the outside circles of the first and the second annual rings covered by the solder mask layer respectively form a covering portion, the two covering portions are separated by an interval and are located at two ends of a straight distance between the first and the second annual rings. ### Claim 15 (depends on 14) The printed circuit board according to claim 14, wherein the portion of the outside circle of the first annual ring exposed in the first opening forms two exposing portions, and the portion of the outside circle of the second annual ring exposed in the second opening forms two exposing portions, and each covering portion is correspondingly interposed between two exposing portions disposed at two lateral sides of the covering portion. ### Claim 16 (depends on 14) The printed circuit board according to claim 14, wherein a portion of the surface around the outside circle of the first annual ring exposed in the first opening forms two opening aligning portions, and each covering portion is correspondingly interposed between two opening aligning portions disposed at two lateral sides of the covering portion. ### Claim 17 (depends on 14) The printed circuit board according to claim 14, wherein a margin of each covering portion in the radial directions of the first and the second annual rings is about a half of margins of the first and the second annual rings. ### Claim 18 (depends on 16) The printed circuit board according to claim 16, wherein margins of the two opening aligning portions in the radial directions of the first and the second annual rings are about a half of margins of the first and the second annual rings. ### Claim 19 (depends on 16) The printed circuit board according to claim 16, wherein margins of each two opening aligning portions in the radial directions of the first and the second annual rings are equivalent to a maximum misregistration of the solder mask layer with respect to the first and the second annual rings. ### Claim 20 (depends on 12) The printed circuit board according to claim 12, wherein the outside circle of the first annual ring is divided by the solder mask layer into several covering portions at an equal distance, the outside circle of the first annual ring is divided by the first opening into several exposing portions at an equal distance, and the covering portions and the exposing portions are disposed in alternating sequence. ### Claim 21 (depends on 20) The printed circuit board according to claim 20, wherein each covering portion and each exposing portion respectively occupy 1/4˜1/16 of the circumference of the outside circle of the first annual ring. ### Claim 22 (depends on 21) The printed circuit board according to claim 21, wherein when the quantity of the covering portions is four and the quantity of the exposing portions is also four, each covering portion and each exposing portion respectively occupy 1/6˜1/8 of the circumference of the outside circle of the first annual ring. ### Claim 23 (depends on 12) The printed circuit board according to claim 12, wherein the outside circle of the second annual ring is divided by the solder mask layer into several covering portions at an equal distance, the outside circle of the second annual ring is divided by the second opening into several exposing portions at an equal distance, and the covering portions and the exposing portions are disposed in alternating sequence. ### Claim 24 (depends on 23) The printed circuit board according to claim 23, wherein each covering portion and each exposing portion respectively occupy 1/4˜1/16 of the circumference of the outside circle of the second annual ring. ### Claim 25 (depends on 24) The printed circuit board according to claim 24, wherein when the quantity of the covering portions is four and the quantity of the exposing portions is also four, each covering portion and each exposing portion respectively occupy 1/6˜1/8 of the circumference of the outside circle of the second annual ring. ### Claim 26 (depends on 12) The printed circuit board according to claim 12, further comprising two solders, wherein the two terminations are respectively fixed in the first and the second plated through holes and electrically connected to the first and the second annual rings respectively by each solder.