# US 2013/0153281 A1 · Light source mount > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2013/0153281 A1 - Document ID: US20130153281A1 - Status: Published application - Kind: A1 - Application number: 13/818,690 - Filed: 2011-08-24 - Published: 2013-06-20 - Earliest claimed: 2010-08-24 - Assignees: Colorchip (Israel) Ltd. - Inventors: David Benbassat - Web page: https://patentgrep.com/patent/US20130153281A1 ## CPC - H05K 1/02: Details - H01S 5/023: Mount members, e.g. sub-mount members - H01S 5/0233: Mounting configuration of laser chips - H01S 5/0235: Method for mounting laser chips - H01S 5/02355: Fixing laser chips on mounts - H10H 20/8506: {Containers} - H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls - H10W 70/657: {on sidewalls or bottom surfaces of the package substrates, interposers or redistribution layers} - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H01S: DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A mount for a semiconductor device, the mount comprising: an insulating substrate having first and second parallel face surfaces, an edge surface that connects the parallel surfaces and having formed therein a recess having an opening on the first face surface; an electrically conductive plug seated in the recess and having a first exposed surface on or near the edge surface and a second exposed surface on or near the first face surface. ## Claims ### Claim 1 A mount for a semiconductor device, the mount comprising: an insulating substrate having first and second parallel face surfaces, an edge surface that connects the parallel surfaces and having formed therein a recess having an opening on the first face surface; an electrically conductive plug seated in the recess and having a first exposed surface on or near the edge surface and a second exposed surface on or near the first face surface. ### Claim 2 (depends on 1) A mount according to claim 1 and comprising a conductive track formed on the first face surface that electrically contacts the exposed surface of the plug on the first face surface. ### Claim 3 (depends on 1) A mount according to claim 1 wherein the plug has a second surface exposed on or near the second face surface. ### Claim 4 (depends on 3) A mount according to claim 3 and comprising a conductive track formed on the second face surface that electrically contacts the exposed surface of the plug on the second face surface. ### Claim 5 (depends on 1) A mount according to claim 1 wherein the recess is characterized by a cross section having a dimension substantially parallel to the edge surface at a first distance from the edge surface that is smaller than a dimension of the cross section at a second, larger distance from the edge surface. ### Claim 6 (depends on 5) A mount according to claim 5 wherein the recess is formed having a cross section comprising a neck region characterized by a relatively small width substantially parallel to the edge surface, which neck region connects first and second regions characterized by relatively large widths parallel to the narrow width of the neck region. ### Claim 7 (depends on 6) A mount according to claim 6 wherein the cross section has a periphery coincident with a periphery of an area defined by two circles that partially overlap. ### Claim 8 (depends on 5) A mount according to claim 5 wherein the cross section has a trapezoidal shape. ### Claim 9 (depends on 1) A mount according to claim 1 wherein the semiconductor device comprises a laser diode. ### Claim 10 A method of producing a mount for a semiconductor device, the method comprising: forming a recess in a substrate formed from an electrically insulating material and having first and second parallel face surfaces, wherein the recess has an opening on the first face surface; filling the recess with an electrically conductive material; and cutting the substrate to form an edge surface that connects the face surfaces and an exposed surface of the conductive material. ### Claim 11 (depends on 1) A method according to claim 1 wherein forming a recess comprises forming an array of rows and columns of recesses ### Claim 12 (depends on 11) A method according to claim 11 wherein the rows comprise pairs of relatively closely spaced rows. ### Claim 13 (depends on 12) A method according to claim 12 wherein each recess is characterized by a cross section having a dimension parallel to and at a first distance from a line between the recesses in the pair of closely spaced rows to which the recess belongs that is smaller than a dimension of the cross section at a second, larger distance from the line. ### Claim 14 (depends on 13) A method according to claim 13 wherein cutting the substrate comprises cutting the substrate along a line between a pair of closely spaced rows of recesses. ### Claim 15 (depends on 13) A method according to claim 13 wherein the cross section has a periphery coincident with a periphery of an area defined by two circles that partially overlap.