# US 2013/0153279 A1 · Wiring board and mounting structure thereof > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2013/0153279 A1 - Document ID: US20130153279A1 - Status: Published application - Kind: A1 - Application number: 13/819,080 - Filed: 2011-08-25 - Published: 2013-06-20 - Earliest claimed: 2010-08-31 - Assignees: KYOCERA Corporation - Inventors: Katsura Hayashi - Web page: https://patentgrep.com/patent/US20130153279A1 ## CPC - H05K 1/115: {Via connections; Lands around holes or via connections (H05K1/112 takes precedence)} - H05K 1/18: structurally associated with non-printed electric components (H05K1/16 takes precedence) - H05K 3/4673: {Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer (similar methods for protective coatings H05K3/28)} - H05K 2201/0195: Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure - H05K 2201/0209: Inorganic, non-metallic particles - H05K 2201/0266: Size distribution - H05K 2201/09827: Tapered, e.g. tapered hole, via or groove - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract A wiring board according to an embodiment includes an inorganic insulating layer provided with a via-hole which is a penetrating hole, and a via-conductor which is a penetrating conductor disposed inside the via-hole. The inorganic insulating layer includes first inorganic insulating particles connected to each other and second inorganic insulating particles that are larger in particle size than the first inorganic insulating particles and are connected to each other via the first inorganic insulating particles, and also has, at an inner wall of the via-hole V, a protrusion including at least part of the second inorganic insulating particle. The protrusion is covered with the via-conductor. ## Claims ### Claim 1 A wiring board, comprising: an inorganic insulating layer provided with a penetrating hole; and a penetrating conductor disposed inside the penetrating hole, wherein the inorganic insulating layer includes first inorganic insulating particles connected to each other and second inorganic insulating particles that are larger in particle size than the first inorganic insulating particles and are connected to each other via the first inorganic insulating particles, the inorganic insulating layer having, at an inner wall of the penetrating hole, a protrusion including at least part of the second inorganic insulating particle, and the protrusion is covered with the penetrating conductor. ### Claim 2 (depends on 1) The wiring board according to claim 1, further comprising: a resin layer disposed on the inorganic insulating layer, wherein the penetrating hole passes through both the inorganic insulating layer and the resin layer, and includes a first penetrating portion located in the inorganic insulating layer and a second penetrating portion located in the resin layer, and wherein a ten-point average roughness of the inner wall of the first penetrating portion is greater than a ten-point average roughness of the inner wall of the second penetrating portion. ### Claim 3 (depends on 1) The wiring board according to claim 1, further comprising: a resin layer disposed on the inorganic insulating layer, wherein the penetrating hole passes through both the inorganic insulating layer and the resin layer, is so shaped that its diameter becomes smaller from a inorganic insulating layer side toward a resin layer side, and includes a first penetrating portion located in the inorganic insulating layer and a second penetrating portion located in the resin layer, and wherein an inclination angle of the inner wall of the first penetrating portion relative to a penetrating direction of the penetrating hole is greater than an inclination angle of the inner wall of the second penetrating portion relative to the penetrating direction. ### Claim 4 (depends on 1) The wiring board according to claim 1, wherein a ten-point average roughness of the inner wall of the penetrating hole of the inorganic insulating layer is greater than a ten-point average roughness of a main surface of the inorganic insulating layer. ### Claim 5 (depends on 1) The wiring board according to claim 1, wherein the inorganic insulating layer has, at the inner wall of the penetrating hole, a recess which is created as a result of separation of the second inorganic insulating particle, at least part of which is buried in the inorganic insulating layer, from the inorganic insulating layer, and wherein the recess is filled with part of the penetrating conductor. ### Claim 6 (depends on 1) The wiring board according to claim 1, wherein the second inorganic insulating particle has a spherical shape. ### Claim 7 (depends on 1) The wiring board according to claim 1, wherein the first inorganic insulating particles have a particle size of not less than 3 nm and not more than 110 nm, and wherein the second inorganic insulating particles have a particle size of not less than 0.5 μm and not more than 5 μm. ### Claim 8 (depends on 1) The wiring board according to claim 1, wherein the inorganic insulating layer is made of silicon oxide, and wherein the penetrating conductor is made of copper. ### Claim 9 (depends on 1) A mounting structure, comprising: the wiring board according to claim 1; and an electronic component mounted on the wiring board and electrically connected to the penetrating conductor.