# US 2013/0153278 A1 · Ball grid array package and method of manufacturing the same

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- Number: US 2013/0153278 A1
- Document ID: US20130153278A1
- Status: Published application
- Kind: A1
- Application number: 13/720,266
- Filed: 2012-12-19
- Published: 2013-06-20
- Earliest claimed: 2011-12-20
- Assignees: Samsung Electro-Mechanics Co., Ltd.
- Inventors: Joo Sub Maeng
- Web page: https://patentgrep.com/patent/US20130153278A1

## CPC

- H05K 1/111: {Pads for surface mounting, e.g. lay-out}
- H05K 13/0465: {by soldering (H05K13/0469 takes precedence)}
- H05K 3/3436: {having an array of bottom contacts, e.g. pad grid array or ball grid array components}
- H05K 3/3452: Solder masks
- Y02P 70/50: Manufacturing or production processes characterised by the final manufactured product
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS

## Abstract

Disclosed herein is a ball grid array (BGA) package including: a printed circuit board (PCB) in which a device is mounted via solder balls, wherein the PCB includes a plurality of pad patterns each including the solder balls and having the same shape. A uniform amount of solder balls is included in the pad patterns having the same shape, and thus the BGA package according to the present invention can prevent a short or open from occurring due to a conventional problem of an excessive or small amount of solder balls.

## Claims

### Claim 1

A ball grid array (BGA) package comprising:
a printed circuit board (PCB) in which a device is mounted via solder balls,
wherein the PCB includes a plurality of pad patterns each including the solder balls and having the same shape.

### Claim 2 (depends on 1)

The BGA package as set forth in claim 1, wherein the plurality of pad patterns includes:
pads; and
lead lines led from one side of the pads.

### Claim 3 (depends on 2)

The BGA package as set forth in claim 2, wherein the pads have one of polygonal shapes including a circular shape, an oval shape, and a rectangular shape.

### Claim 4 (depends on 2)

The BGA package as set forth in claim 2, wherein the lead lines each are electrically connected to circuits of the PCB, and line widths thereof have ratios of 1/10˜½ with respect to widths of the pads.

### Claim 5 (depends on 1)

The BGA package as set forth in claim 1, wherein the PCB further includes a solder resist (SR) surrounding each of the plurality of pad patterns.

### Claim 6 (depends on 1)

The BGA package as set forth in claim 1, wherein the number of the pad patterns is determined according to a size of a region in which the device is mounted or the number of input and output pins of the device.

### Claim 7

A method of manufacturing a BGA package, the method comprising:
setting a mounting region of a PCB in which a device is mounted; and
mounting the device on the mounting region via solder balls.

### Claim 8 (depends on 7)

The method as set forth in claim 7, wherein the setting of the mounting region includes:
designing pad patterns having the same shape included in the mounting region;
forming a plurality of pad patterns in the mounting region according to design information; and
uniformly forming solder balls in each of the plurality of pad patterns.

### Claim 9 (depends on 8)

The method as set forth in claim 8, wherein the plurality of pad patterns include pads and lead lines led from one side of the pads, and
wherein the pads have polygonal shapes.

### Claim 10 (depends on 9)

The method as set forth in claim 9, wherein line widths of the lead lines are proportional to an amount of current applied to the plurality of pad patterns, and have ratios of 1/10 ˜½ with respect to widths of the pads.

### Claim 11 (depends on 8)

The method as set forth in claim 8, wherein the designing of the pad patterns includes forming an SR surrounding each of the plurality of pad patterns.

### Claim 12 (depends on 7)

The method as set forth in claim 7, wherein the mounting the device on the mounting region, the solder balls are uniformly deposited on the mounting region, and the device is soldered on the mounting region by the solder balls through a reflow process.