# US 2013/0153274 A1 · Circuit board capable of preventing contact of a gold finger and solder

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- Number: US 2013/0153274 A1
- Document ID: US20130153274A1
- Status: Published application
- Kind: A1
- Application number: 13/664,434
- Filed: 2012-10-31
- Published: 2013-06-20
- Earliest claimed: 2011-12-14
- Assignees: Wistron Corporation
- Inventors: Chen-Liang Ku; Ko-Chin Lee
- Web page: https://patentgrep.com/patent/US20130153274A1

## CPC

- H05K 1/11: Printed elements for providing electric connections to or between printed circuits
- H05K 3/3485: Application of solder paste, slurry or powder (using printing techniques to form the desired conductive pattern of the printed circuit by applying conductive material H05K3/12)
- H05K 2201/09036: Recesses or grooves in insulating substrate
- H05K 2201/09472: Recessed pad for surface mounting; Recessed electrode of component
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

A circuit board includes a substrate whereon a sunken portion is formed. The circuit board further includes a gold finger structure disposed inside the sunken portion. A height difference is formed between a top surface of the gold finger structure and a surface of the substrate substantially.

## Claims

### Claim 1

A circuit board, comprising:
a substrate whereon a sunken portion is formed; and
a gold finger structure disposed inside the sunken portion on the substrate, and a height difference being formed between a top surface of the gold finger structure and a surface of the substrate substantially.

### Claim 2 (depends on 1)

The circuit board of claim 1, wherein the height difference between the top surface of the gold finger structure and the surface of the substrate is substantially greater than a particle size of solder paste.

### Claim 3 (depends on 2)

The circuit board of claim 2, wherein the height difference between the top surface of the gold finger structure and the surface of the substrate is substantially greater than 50 μm.

### Claim 4 (depends on 1)

The circuit board of claim 1, wherein the height difference between the top surface of the gold finger structure and the surface of the substrate is substantially greater than 50 μm.

### Claim 5 (depends on 1)

The circuit board of claim 1, further comprising a pad disposed on the substrate, and the height difference being formed between a surface of the pad and the top surface of the gold finger structure substantially.

### Claim 6 (depends on 5)

The circuit board of claim 5, further comprising a solder mask layer disposed on the substrate where the sunken portion and the pad are not disposed.

### Claim 7 (depends on 1)

The circuit board of claim 1, further comprising a peelable mask film peelably adhered to the top surface of the gold finger structure.

### Claim 8 (depends on 7)

The circuit board of claim 7, wherein a thickness of the peelable mask film is substantially less than or equal to the height difference between the top surface of the gold finger structure and the surface of the substrate.

### Claim 9 (depends on 7)

The circuit board of claim 7, wherein the peelable mask film is made of high temperature endurable material.