# US 2013/0153272 A1 · Printed circuit board

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- Number: US 2013/0153272 A1
- Document ID: US20130153272A1
- Status: Published application
- Kind: A1
- Application number: 13/598,842
- Filed: 2012-08-30
- Published: 2013-06-20
- Earliest claimed: 2011-12-16
- Assignees: Hon Hai Precision Industry Co., Ltd.
- Inventors: HSING-HUI CHIU; PEI-JYUN SU; SZE-YU LIN
- Web page: https://patentgrep.com/patent/US20130153272A1

## CPC

- H05K 1/0215: {Grounding of printed circuits by connection to external grounding means}
- H05K 1/116: {Lands, clearance holes or other lay-out details concerning the surrounding of a via}
- H05K 3/28: Applying non-metallic protective coatings {(H05K3/0091 takes precedence; methods for intermediate insulating layers for build-up multilayer circuits H05K3/4673)}
- H05K 2201/0367: Metallic bump or raised conductor not used as solder bump
- H05K 2201/09063: Holes or slots in insulating substrate not used for electrical connections
- H05K 2201/0949: Pad close to a hole, not surrounding the hole
- H05K 2201/09618: Via fence, i.e. one-dimensional array of vias
- H05K 2201/10409: Screws
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

A printed circuit board includes a top layer, a bottom layer, and a mounting hole vertically extending through the top layer and the bottom layer. A first copper ring is located on a top surface of the top layer and around the mounting hole. A second copper ring is located a bottom surface of the bottom layer and around the mounting hole. A number of first pads are positioned on the first copper ring. A number of second pads are positioned on the second copper ring. The first and second copper rings are covered with solder mask, but the first and second pads are not covered with the solder mask.

## Claims

### Claim 1

A printed circuit board (PCB), comprising:
a top layer comprising a top surface;
a bottom layer comprising a bottom surface;
a mounting hole vertically extending through the top layer and the bottom layer;
a first copper ring located on the top surface of the top layer and around the mounting hole;
a second copper ring located on the bottom surface of the bottom layer and around the mounting hole;
a plurality of first pads positioned on the first copper ring;
a plurality of second pads positioned on the second copper ring; and
solder mask covering the first and second copper rings, without covering the first and second pads.

### Claim 2 (depends on 1)

The PCB of claim 1, wherein the first pads are located on the first copper ring along the outer circumference of the first copper ring, and there is an equal interval between every two adjacent first pads; the second pads are located on the second copper ring along the outer circumference of the second copper ring, and there is an equal interval between every two adjacent second pads.

### Claim 3 (depends on 2)

The PCB of claim 2, wherein the first copper ring aligns with the second copper ring, and each first pad aligns with a corresponding second pad.

### Claim 4 (depends on 1)

The PCB of claim 1, further comprising a ground layer sandwiched between the top layer and the bottom layer, wherein the mounting hole extends through the ground layer.

### Claim 5 (depends on 4)

The PCB of claim 4, wherein each of the top layer and the bottom layer is an insulation layer.

### Claim 6 (depends on 5)

The PCB of claim 5, further comprising a plurality of through holes extending through the top layer, the ground layer, and the bottom layer, wherein each through hole is defined in an interval between two adjacent first pads, and coated with conductive material and electrically connected to the first copper ring, the second copper ring, and the ground layer, the first copper ring and the second copper ring are electrically connected to the ground layer through the through holes.