# US 2013/0153192 A1 · Heat dissipating device

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 2013/0153192 A1
- Document ID: US20130153192A1
- Status: Published application
- Kind: A1
- Application number: 13/426,598
- Filed: 2012-03-22
- Published: 2013-06-20
- Earliest claimed: 2011-12-18
- Assignees: Cooler Master Development Corporation
- Inventors: Chia-Yu Lin
- Web page: https://patentgrep.com/patent/US20130153192A1

## CPC

- H10W 40/037: {Assembling together parts thereof}
- H10W 40/226: {characterised by projecting parts, e.g. fins to increase surface area (leadframes for cooling H10W70/461)}
- H10W 40/228: {the projecting parts being wire-shaped or pin-shaped}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A heat dissipating device includes a base and a plurality of heat dissipating fins. The base includes a substrate and a box, wherein the substrate and the box are formed integrally and the box has an accommodating space therein. Each of the heat dissipating fins includes a heat dissipating portion, a fixing portion and an overflow-proof structure. The fixing portion is fixed in the base. The overflow-proof structure is connected between the heat dissipating portion and the fixing portion. A width of the overflow-proof structure is larger than a width of the heat dissipating portion and larger than a width of the fixing portion.

## Claims

### Claim 1

A heat dissipating device comprising:
a base comprising a substrate and a box, the substrate and the box being formed integrally, the box having an accommodating space therein; and
a plurality of heat dissipating fins, each of the heat dissipating fins comprising:
a heat dissipating portion;
a fixing portion fixed in the base; and
an overflow-proof structure connected between the heat dissipating portion and the fixing portion;
wherein a width of the overflow-proof structure is larger than a width of the heat dissipating portion.

### Claim 2 (depends on 1)

The heat dissipating device of claim 1, wherein the base further comprises a flange protruding from a periphery of the box.

### Claim 3 (depends on 1)

The heat dissipating device of claim 1 further comprising a plurality of heat pipes disposed in the substrate.

### Claim 4 (depends on 1)

The heat dissipating device of claim 1, wherein a length of the overflow-proof structure protruded from the fixing portion is between 1 mm and 10 mm.

### Claim 5 (depends on 1)

The heat dissipating device of claim 1, wherein each of the heat dissipating fins further comprises a recess structure formed on the fixing portion.

### Claim 6 (depends on 5)

The heat dissipating device of claim 5, wherein each of the heat dissipating fins further comprises a hook structure formed in the recess structure.

### Claim 7 (depends on 1)

The heat dissipating device of claim 1, wherein each of the heat dissipating fins further comprises a protruding structure protruded from one end of the fixing portion.

### Claim 8 (depends on 1)

The heat dissipating device of claim 1, wherein each of the heat dissipating fins further comprises an extending structure extended from the overflow-proof structure toward the fixing portion.

### Claim 9 (depends on 8)

The heat dissipating device of claim 8, wherein the overflow-proof structure and the extending structure are formed as U-shape.

### Claim 10 (depends on 1)

The heat dissipating device of claim 1, wherein a thickness of the overflow-proof structure is uniform.

### Claim 11 (depends on 1)

The heat dissipating device of claim 1, wherein a thickness of the overflow-proof structure varies gradiently.

### Claim 12 (depends on 1)

The heat dissipating device of claim 1, wherein each of the heat dissipating fins is a flat-type heat dissipating fin.

### Claim 13 (depends on 1)

The heat dissipating device of claim 1, wherein each of the heat dissipating fins is a cylinder-type heat dissipating fin.

### Claim 14 (depends on 1)

The heat dissipating device of claim 1, wherein the width of the overflow-proof structure is larger than a width of the fixing portion.