# US 2013/0153189 A1 · Heat dissipating fin, heat dissipating device and method of manufacturing the same

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- Number: US 2013/0153189 A1
- Document ID: US20130153189A1
- Status: Published application
- Kind: A1
- Application number: 13/329,313
- Filed: 2011-12-18
- Published: 2013-06-20
- Earliest claimed: 2011-12-18
- Inventors: Chia-Yu Lin; Yen Tsai
- Web page: https://patentgrep.com/patent/US20130153189A1

## CPC

- B23P 15/26: heat exchangers {or the like (making heat exchangers by methods covered by other subclasses B21D53/02)}
- B21D 53/02: heat exchangers {or parts thereof}, e.g. radiators, condensers {fins, headers}(making finned or ribbed tubes by fixing strip material or the like to tubes B21C37/22)
- B22D 19/0063: {finned exchangers (cylinders B22D19/0018)}
- F28F 3/00: Plate-like or laminated elements; Assemblies of plate-like or laminated elements (specially adapted for movement F28F5/00)
- F28F 3/022: {the means being wires or pins}
- F28F 3/06: the means being attachable to the element
- H10W 40/22: characterised by their shape, e.g. having conical or cylindrical projections
- H10W 40/228: {the projecting parts being wire-shaped or pin-shaped}
- B23P 2700/10: Heat sinks
- F28F 2275/14: by using form fitting connection, e.g. with tongue and groove
- Y10T 29/4935: Heat exchanger or boiler making
- B23P: METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS (arrangements for copying or controlling B23Q)
- B21D: WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL (working or processing of wire B21F)
- B22D: CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES (shaping of plastics or substances in a plastic state B29C; metallurgical processing, selection of substances to be added to metal C21, C22)
- F28F: DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION (water and air traps, air venting F16)
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

A heat dissipating device includes a base and a plurality of heat dissipating fins. Each of the heat dissipating fins includes a heat dissipating portion, a fixing portion and an overflow-proof structure. The fixing portion is fixed in the base. The overflow-proof structure is connected between the heat dissipating portion and the fixing portion. A width of the overflow-proof structure is larger than a width of the heat dissipating portion and larger than a width of the fixing portion.

## Claims

### Claim 1

A heat dissipating fin comprising:
a heat dissipating portion;
a fixing portion; and
an overflow-proof structure connected between the heat dissipating portion and the fixing portion;
wherein a width of the overflow-proof structure is larger than a width of the heat dissipating portion.

### Claim 2 (depends on 1)

The heat dissipating fin of claim 1, wherein a length of the overflow-proof structure protruded from the fixing portion is between 1 mm and 10 mm.

### Claim 3 (depends on 1)

The heat dissipating fin of claim 1, further comprising a recess structure formed on the fixing portion.

### Claim 4 (depends on 3)

The heat dissipating fin of claim 3, further comprising a hook structure formed in the recess structure.

### Claim 5 (depends on 1)

The heat dissipating fin of claim 1, further comprising a protruding structure protruded from one end of the fixing portion.

### Claim 6 (depends on 1)

The heat dissipating fin of claim 1, further comprising an extending structure extended from the overflow-proof structure toward the fixing portion.

### Claim 7 (depends on 6)

The heat dissipating fin of claim 6, wherein the overflow-proof structure and the extending structure are formed as U-shape.

### Claim 8 (depends on 1)

The heat dissipating fin of claim 1, wherein a thickness of the overflow-proof structure is uniform or varies gradiently.

### Claim 9

A heat dissipating device comprising:
a base; and
a plurality of heat dissipating fins, each of the heat dissipating fins comprising:
a heat dissipating portion;
a fixing portion fixed in the base; and
an overflow-proof structure connected between the heat dissipating portion and the fixing portion;
wherein a width of the overflow-proof structure is larger than a width of the heat dissipating portion.

### Claim 10 (depends on 9)

The heat dissipating device of claim 9, wherein each of the heat dissipating fins further comprises a recess structure formed on the fixing portion.

### Claim 11 (depends on 10)

The heat dissipating device of claim 10, wherein each of the heat dissipating fins further comprises a hook structure formed in the recess structure.

### Claim 12 (depends on 9)

The heat dissipating device of claim 9, wherein each of the heat dissipating fins further comprises a protruding structure protruded from one end of the fixing portion.

### Claim 13 (depends on 9)

The heat dissipating device of claim 9, wherein each of the heat dissipating fins further comprises an extending structure extended from the overflow-proof structure toward the fixing portion.

### Claim 14 (depends on 13)

The heat dissipating device of claim 13, wherein the overflow-proof structure and the extending structure are formed as U-shape.

### Claim 15 (depends on 9)

The heat dissipating device of claim 9, wherein a thickness of the overflow-proof structure is uniform or varies gradiently.

### Claim 16

A method of manufacturing a heat dissipating device comprising:
forming a plurality of heat dissipating fins by a forming process, wherein each of the heat dissipating fins comprises a heat dissipating portion, a fixing portion and an overflow-proof structure, the overflow-proof structure is connected between the heat dissipating portion and the fixing portion, a width of the overflow-proof structure is larger than a width of the heat dissipating portion;
putting the fixing portion of each of the heat dissipating fins into a mold;
pouring a melt metal material into the mold; and
processing the melt metal material by a die casting process so as to form a base, wherein the base covers the fixing portion of each of the heat dissipating fins and the overflow-proof structure of each of the heat dissipating fins prevents the melt metal material from overflowing.

### Claim 17 (depends on 16)

The method of claim 16, wherein the forming process is an aluminum extrusion process and each of the heat dissipating fins is a flat-type heat dissipating fin, or the forming process is a rivet forming process and each of the heat dissipating fins is a cylinder-type heat dissipating fin.

### Claim 18 (depends on 16)

The method of claim 16, wherein forming a plurality of heat dissipating fins by a forming process further comprises forming a recess structure on the fixing portion.

### Claim 19 (depends on 16)

The method of claim 16, wherein forming a plurality of heat dissipating fins by a forming process further comprises forming a protruding structure on the fixing portion and enabling the protruding structure to protrude from one end of the fixing portion.

### Claim 20 (depends on 16)

The method of claim 16, wherein forming a plurality of heat dissipating fins by a forming process further comprises forming an extending structure on the overflow-proof structure and enabling the extending structure to extend from the overflow-proof structure toward the fixing portion.

### Claim 21 (depends on 1)

The heat dissipating fin of claim 1, wherein the width of the overflow-proof structure is larger than a width of the fixing portion.

### Claim 22 (depends on 9)

The heat dissipating device of claim 9, wherein the width of the overflow-proof structure is larger than a width of the fixing portion.

### Claim 23 (depends on 16)

The method of claim 16, wherein the width of the overflow-proof structure is larger than a width of the fixing portion.
