# US 2013/0153030 A1 · Encapsulated flexible electronic device, and corresponding manufacturing method > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2013/0153030 A1 - Document ID: US20130153030A1 - Status: Published application - Kind: A1 - Application number: 13/713,576 - Filed: 2012-12-13 - Published: 2013-06-20 - Earliest claimed: 2011-12-16 - Assignees: STMicroelectronics S.r.l. - Inventors: Corrado Accardi; Stella Loverso; Sebastiano Ravesi; Noemi Graziana Sparta - Web page: https://patentgrep.com/patent/US20130153030A1 ## CPC - H10F 71/137: {Batch treatment of the devices} - G06F 1/1626: {with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]} - G06F 1/1652: {the display being flexible, e.g. mimicking a sheet of paper, or rollable} - G06F 3/041: Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means - H10F 19/80: Encapsulations or containers for integrated devices, or assemblies of multiple devices, having photovoltaic cells - H10F 19/804: {Materials of encapsulations} - H10F 77/50: Encapsulations or containers (for photovoltaic modules H10F19/80) - H10W 74/00: Encapsulations, e.g. protective coatings - H10W 74/01: Manufacture or treatment - Y02E 10/50: Photovoltaic [PV] energy - H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION - G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N) - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - Y02E: REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION ## Abstract The disclosure relates to an encapsulated flexible electronic device comprising a flexible electronic device, wherein the flexible electronic device is protected by a protective coating layer, a first cover sheet and a second cover sheet being made of patterned and developed dry photoresist films. The encapsulated flexible electronic device may be used to directly realize different type of electronic devices, such as smart sensor devices. ## Claims ### Claim 1 An encapsulated flexible electronic device comprising: a flexible electronic device; and a protective coating layer, a first cover sheet, and a second cover sheet on the flexible electronic, each of the protective coating layer, first cover sheet, and second cover sheet being a patterned and developed dry photoresist film. ### Claim 2 (depends on 1) An encapsulated flexible electronic device according to claim 1, wherein each of the protective coating layer, first cover sheet, and second cover sheet is a negative, transparent, and permanent solvent dry photoresist film. ### Claim 3 (depends on 1) An encapsulated flexible electronic device according to claim 1, wherein said protective coating layer, said first cover sheet and said second cover sheet have a modulable thickness. ### Claim 4 (depends on 1) An encapsulated flexible electronic device according to claim 1, wherein said flexible electronic device is a flexible photovoltaic cell. ### Claim 5 (depends on 1) An encapsulated flexible electronic device according to claim 1, wherein said flexible electronic device is a touch screen. ### Claim 6 (depends on 1) An encapsulated flexible electronic device according to claim 1, wherein said first and second cover sheets are respectively back and front sheets of said flexible electronic device and are configured to fully protect the flexible electronic device from mechanical stress. ### Claim 7 A method for manufacturing an encapsulated flexible electronic device, the method comprising: providing a flexible electronic device; forming a protective coating layer, a first cover sheet, and a second cover sheet on the flexible electronic, each of the protective coating layer, first cover sheet, and second cover sheet being a patterned and developed dry photoresist film. ### Claim 8 (depends on 7) The method according to claim 7, wherein the forming includes: providing a first dry photoresist film on a first surface of said flexible electronic device; patterning said first dry photoresist film in a negative form with respect to said flexible electronic device; developing said first dry photoresist film, obtaining the protective coating layer on said surface of said flexible electronic device; providing a second dry photoresist film on a second surface of said flexible electronic device, opposite to said first surface; providing a third dry photoresist film on a surface of said protective coating layer; patterning said second and third dry photoresist films in a negative form with respect to the encapsulated flexible electronic device, so obtaining first and second cover sheets; and curing said first and second cover sheets. ### Claim 9 (depends on 8) The method according to claim 8, wherein providing said first dry photoresist film comprises laminating said first dry photoresist film on said first surface of said flexible electronic device. ### Claim 10 (depends on 8) The method according to claim 8, wherein patterning said first dry photoresist film comprises exposing said first dry photoresist film covered by a photolithographic mask shaped in a negative form with respect to said encapsulated flexible electronic device. ### Claim 11 (depends on 8) The method according to claim 8, wherein providing said second dry photoresist film comprises laminating said second dry photoresist film on the second surface of said flexible electronic device and providing said third dry photoresist film comprises laminating said third dry photoresist film on said surface of said protective coating layer, which is not in contact with said flexible electronic device. ### Claim 12 (depends on 11) The method according to claim 11, wherein laminating said second and third dry photoresist films respectively comprise multiple steps of laminating dry photoresist films with different thickness. ### Claim 13 A system, comprising: a flexible photovoltaic cell; a protective coating layer, a first cover sheet, and a second cover sheet on the flexible electronic, each of the protective coating layer, first cover sheet, and second cover sheet being a patterned and developed dry photoresist film; and a sensor subsystem electrically coupled to the photovoltaic cell. ### Claim 14 (depends on 13) A system according to claim 13, wherein each of the protective coating layer, first cover sheet, and second cover sheet is a negative, transparent, and permanent solvent dry photoresist film. ### Claim 15 (depends on 13) A system according to claim 13, further comprising a communication subsystem electrically coupled to the photovoltaic cell. ### Claim 16 (depends on 13) A system according to claim 13, wherein said first and second cover sheets are respectively back and front sheets of said photovoltaic cell and are configured to fully protect the photovoltaic cell from mechanical stress.