# US 2013/0153016 A1 · Solar Cell Flip Chip Package Structure and Method for Manufacturing the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2013/0153016 A1 - Document ID: US20130153016A1 - Status: Published application - Kind: A1 - Application number: 13/330,674 - Filed: 2011-12-20 - Published: 2013-06-20 - Earliest claimed: 2011-12-20 - Assignees: Tong Hsing Electronic Industries, Ltd. - Inventors: Shao-Pin Ru - Web page: https://patentgrep.com/patent/US20130153016A1 ## CPC - H10F 19/80: Encapsulations or containers for integrated devices, or assemblies of multiple devices, having photovoltaic cells - H10F 77/935: {for photovoltaic devices or modules} - H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills - Y02E 10/50: Photovoltaic [PV] energy - H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - Y02E: REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION ## Abstract The present invention provides a solar cell flip chip package structure, comprising: a substrate having a first surface, a second surface and an opening extending from the first surface to the second surface; a conducting layer disposed on the first surface of the substrate; a solar cell flip chip bonded on the conducting layer; a transparent layer attached on the second surface of the substrate; and a storage space formed between the opening extending from the first surface to the second surface, the solar cell flip chip and the transparent layer. ## Claims ### Claim 1 A solar cell flip chip package structure, comprising: a substrate having a first surface, a second surface and an opening extending from the first surface to the second surface; a conducting layer disposed on the first surface of the substrate; a solar cell flip chip bonded on the conducting layer; a transparent layer attached on the second surface of the substrate; and a storage space formed between the opening extending from the first surface to the second surface, the solar cell flip chip and the transparent layer. ### Claim 2 (depends on 1) The solar cell flip chip package structure according to claim 1, wherein the solar cell flip chip package structure of claim 1, wherein the substrate is formed by ceramic, glass, or organic materials. ### Claim 3 (depends on 1) The solar cell flip chip package structure according to claim 1, wherein the conducting layer comprises a copper trace and a copper pillar. ### Claim 4 (depends on 3) The solar cell flip chip package structure according to claim 3, wherein the copper trace and the copper pillar are formed in one piece by electroplating. ### Claim 5 (depends on 3) The solar cell flip chip package structure according to claim 3, wherein the conducting layer further comprises a surface finish layer selected from a group consisting of Ag, Ag/Au, Ni/Au, Ni/Pd/Au, or any combination of the group. ### Claim 6 (depends on 1) The solar cell flip chip package structure according to claim 1, wherein the solar cell flip chip further comprises at least one contact point for connecting to the conducting layer. ### Claim 7 (depends on 6) The solar cell flip chip package structure according to claim 6, wherein each of the at least one contact point is a bump selected from a group consisting of Au, Cu, Ag, Al, Sn or any combination of the group. ### Claim 8 (depends on 7) The solar cell flip chip package structure according to claim 7, wherein each of the at least one contact point further comprises a dam sealing structure. ### Claim 9 (depends on 1) The solar cell flip chip package structure according to claim 1, further comprising a conducting circuit formed on the second surface of the substrate. ### Claim 10 (depends on 9) The solar cell flip chip package structure according to claim 9, wherein the conducting circuit further comprises a surface finish layer selected from a group consisting of Ag, Ag/Au, Ni/Au, Ni/Pd/Au, or any combination of the group. ### Claim 11 (depends on 1) The solar cell flip chip package structure according to claim 1, wherein the storage space is further filled to the full with an optical epoxy or silicon adhesive. ### Claim 12 A solar cell flip chip package structure, comprising: a substrate having a first surface, a second surface and an opening extending from the first surface to the second surface; a conducting layer disposed on the first surface of the substrate; a solar cell flip chip bonded on the conducting layer; a transparent layer formed by glass attached on the second surface of the substrate; and a storage space formed between the opening extending from the first surface to the second surface, the solar cell flip chip and the transparent layer. ### Claim 13 A method for manufacturing solar cell flip chip package structure, comprising: forming a rectangular opening from a substrate; covering a first conducting layer top surface of the substrate by electroplating, plating a surface finish layer on the first conducting layer; planting bumps on the surface finish layer for electrically conducting to a solar cell flip chip; dispensing glue on the second surface of the substrate; and adhering a transparent layer to the second surface of the substrate for covering on the rectangular opening. ### Claim 14 (depends on 13) The method for manufacturing solar cell flip chip package structure according to claim 13, wherein the substrate is formed by ceramic, glass, or organic materials. ### Claim 15 (depends on 13) The method for manufacturing solar cell flip chip package structure according to claim 13, wherein the first conducting layer comprises a copper trace and a copper pillar. ### Claim 16 (depends on 15) The method for manufacturing solar cell flip chip package structure according to claim 15, wherein the copper trace and the copper pillar are formed in one piece by electroplating. ### Claim 17 (depends on 13) The method for manufacturing solar cell flip chip package structure according to claim 13, wherein the surface finish layer is selected from a group consisting of Ag, Ag/Au, Ni/Au, Ni/Pd/Au, or any combination of the group. ### Claim 18 (depends on 13) The method for manufacturing solar cell flip chip package structure according to claim 13, wherein bumps are selected from a group consisting of Au, Cu, Ag, Al, Sn or any combination of the group. ### Claim 19 (depends on 13) The method for manufacturing solar cell flip chip package structure according to claim 13, wherein the transparent layer is formed by glass. ### Claim 20 (depends on 13) The method for manufacturing solar cell flip chip package structure according to claim 13, further comprising the step of filling to the full with an optical epoxy or silicon adhesive in the rectangular opening.