# US 2013/0152694 A1 · Sensor with vacuum cavity and method of fabrication

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- Number: US 2013/0152694 A1
- Document ID: US20130152694A1
- Status: Published application
- Kind: A1
- Application number: 13/666,775
- Filed: 2012-11-01
- Published: 2013-06-20
- Earliest claimed: 2011-11-01
- Inventors: Ilkka Urvas; Andrei Jurievich Pavlov; Yelena Vasiljevna Pavlova
- Web page: https://patentgrep.com/patent/US20130152694A1

## CPC

- G01L 9/0048: {Details about the mounting of the diaphragm to its support or about the diaphragm edges, e.g. notches, round shapes for stress relief}
- G01L 9/0073: {using a semiconductive diaphragm}
- G01L: MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE (weighing G01G)

## Abstract

A MEMS pressure sensor device comprises a sensor element positioned on top of a carrier and a cavity. The sensor element hermetically seals the cavity. An electrode is coupled to the cavity that forms a pressure transducer together with the sensor element. The cavity is created by a density changing material.

## Claims

### Claim 1

A MEMS pressure sensor device, comprising:
a sensor element positioned on top of a carrier and
a cavity, wherein the sensor element hermetically seals the cavity,
an electrode coupled to the cavity that forms a pressure transducer together with the sensor element, wherein the cavity is created by a density changing material.