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US 2013/0140056 A1Published application
Waterproof structure for conductive path
AssigneeYazaki Corporation
InventorsHideomi Adachi, Hidehiko Kuboshima
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AssigneeYazaki Corporation
InventorsHideomi Adachi, Hidehiko Kuboshima
Estimating the term…
The present invention provides a waterproof structure for a conductive path which waterproofs a conductive path without imposing an unnecessary load on a conductor, and can sufficiently obtain a creepage distance. A plurality of grooves 9 is formed on the outer circumferential surface 8 of an insulator 7. The grooves 9 are formed to be hollow by heat or cutting. The grooves 9 are formed within a predetermined range L on the outer circumferential surface 8 of the insulator 7. This predetermined range L is set as a range in which an overmold part 5 is provided. The overmold part 5 is a seal member made of an elastomer, and is disposed and formed within the predetermined range L of an electric wire 2. Also, the overmold part 5 is formed to fill all of the three grooves 9.
A waterproof structure for a conductive path in which a groove is provided to extend in a circumferential direction within a predetermined range on an outer circumferential surface of an insulator covering a conductor, and an overmold part is formed of an elastomer over the entire predetermined range such that the overmold part fills the groove.
Dependencies are inferred from the claim text.