Microchip and Method of Using the Same
AssigneeRohm Co., Ltd.
InventorsAkinori Yokogawa, Toshihiro Mori
Life of this patent
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Abstract
A microchip including a first substrate with a groove formed on a substrate surface or a pass-through hole passing in a thickness direction of the substrate, and one or more second substrates laminated on a surface of the first substrate; the microchip including an optical measurement cuvette consisting of a space configured by the groove or the pass-through hole, and a substrate surface of the second substrate; wherein a side wall surface of the second substrate is positioned on an inner side than a side wall surface of the first substrate in at least one part of a side wall surface of the microchip, and a method of using the same are provided.
Claims6
A microchip including a first substrate with a groove formed on a substrate surface or a pass-through hole passing in a thickness direction of the substrate, and one or more second substrates laminated on a surface of said first substrate;
- the microchip comprising:
- an optical measurement cuvette consisting of a space configured by said groove or said pass-through hole, and a substrate surface of said second substrate;
- wherein
- a side wall surface of said second substrate is positioned on an inner side than a side wall surface of said first substrate in at least one part of a side wall surface of said microchip.
6-17. (canceled)
Dependencies are inferred from the claim text.