Methods for cleaving a bonded wafer structure
AssigneeMEMC Electronic Materials, Inc.
InventorsGregory A. Young, Jeffrey L. Libbert
Life of this patent
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Abstract
Apparatus and methods for mechanically cleaving a bonded wafer structure are disclosed. The apparatus and methods involve clamps that grip the bonded wafer structure and are actuated to cause the bonded structure to cleave.
Claims17
A method of cleaving a bonded wafer structure comprising a first wafer and a second wafer, the first wafer having a peripheral edge including a first portion, the second wafer having a peripheral edge including a second portion, the first portion disposed opposite the second portion, the method comprising:
- contacting the first portion of the peripheral edge of the first wafer with a surface of a first clamp mounted on a first arm;
- contacting the second portion of the peripheral edge of the second wafer with a surface of a second clamp mounted on a second arm;
- and
- cleaving the bonded wafer structure by at least one of (1) applying an upward force on the first wafer by actuating the first clamp upward or (2) applying a downward force on the second wafer by actuating the second clamp downward.
A method of cleaving a bonded wafer structure comprising a first wafer and a second wafer, the first wafer having a peripheral edge including a first portion, the second wafer having a peripheral edge including a second portion, the first portion disposed opposite the second portion, the method comprising:
- contacting the first portion of the peripheral edge of the first wafer with a surface of an annular member of a first grasping member;
- contacting the second portion of the peripheral edge of the second wafer with a surface of an annular member of a second grasping member;
- and
- cleaving the bonded wafer structure by at least one of (1) applying an upward force on the first wafer by actuating the first grasping member upward or (2) applying a downward force on the second wafer by actuating the second grasping member downward.
Dependencies are inferred from the claim text.