Curable epoxy resin compositions and composites made therefrom

A process for preparing a diluent-free curable resin composition or system comprising admixing:

• (A) at least one epoxy resin composition comprising a blend of:
• (A1) at least one epoxy resin, and
• (A2) at least one divinylarene dioxide;
• (B) at least one hardener composition;
• and
• (C) at least one reinforcement materials;
• wherein the viscosity of the curable composition is the range of from about 0.15 Pa-s to about 1.5 Pa-s at room temperature (25° C.);
• and wherein the curable composition is adapted for providing a cured composite product made from the curable composition such that the composition being cured provides a cured composite product having an increased Tg of greater than about 5° C. as compared to a curable composition having a reactive diluent.

A process for preparing cured composite product comprising of the steps of:

• (a) preparing a curable epoxy resin composition comprising admixing.
• (A) at least one epoxy resin composition comprising a blend of:
• (A1) at least one epoxy resin, and
• (A2) at least one divinylarene dioxide;
• (B) at least one hardener composition;
• and
• (C) at least one reinforcement materials;
• wherein the viscosity of the curable composition is the range of from about 0.15 Pa-s to about 1.5 Pa-s;
• and wherein the curable composition is adapted for providing a cured composite product made from the curable composition such that the composition being cured provides a cured composite product having an increased Tg of greater than about 5° C. as compared to a curable composition having a reactive diluent;
• and
• (b) curing the curable epoxy resin composition at a temperature of from about 20° C. to about 300° C.