# US 2013/0096044 A1 · Liquid concentrate for cleaning composition, cleaning composition and cleaning method

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- Number: US 2013/0096044 A1
- Document ID: US20130096044A1
- Status: Published application
- Kind: A1
- Application number: 13/805,735
- Filed: 2011-05-31
- Published: 2013-04-18
- Earliest claimed: 2010-07-09
- Assignees: Kaken Tech Co., Ltd.
- Inventors: Shigeo Hori; Hiroki Nakatsukasa; Yuki Akamatsu
- Web page: https://patentgrep.com/patent/US20130096044A1

## CPC

- C11D 7/5013: {containing nitrogen}
- B23K 35/3612: {with organic compounds as principal constituents}
- B23K 35/362: Selection of compositions of fluxes (B23K35/365, B23K35/368 take precedence)
- C11D 7/5022: {containing oxygen}
- C11D 7/5027: {Hydrocarbons}
- C23G 5/06: using emulsions
- H05K 3/22: Secondary treatment of printed circuits {(H05K3/1283 takes precedence; embedding circuits in grooves by pressure H05K3/107)}
- C11D 7/24: Hydrocarbons
- C11D 7/247: {aromatic}
- C11D 7/261: {Alcohols; Phenols}
- C11D 7/263: {Ethers}
- C11D 7/264: {Aldehydes; Ketones; Acetals or ketals}
- C11D 2111/22: Electronic devices, e.g. PCBs or semiconductors
- H05K 2203/0783: Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
- H05K 2203/122: Organic non-polymeric compounds, e.g. oil, wax or thiol
- C11D: DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- C23G: CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

Provided is a liquid concentrate for cleaning composition which could exhibit excellent environmental safety etc. by adding afterward a predetermined amount of water, and also has excellent regeneration efficiency, and provided are a cleaning composition and a cleaning method thereof. Disclosed is a liquid concentrate for cleaning composition which is used as a mixture with water and is intended for cleaning an object to be cleaned in a clouded state, with a predetermined amount of water having been added thereto, the liquid concentrate for cleaning composition including, a first organic solvent which is a predetermined hydrophobic glycol ether compound or the like, and a second organic solvent which is a predetermined hydrophilic amine compound.

## Claims

### Claim 1

A liquid concentrate for cleaning composition for cleaning intended for being used as a mixture with water and also for cleaning an object to be cleaned in a clouded state with an amount of water which is a value in the range of 50 to 1900 parts by weight relative to 100 parts by weight of the liquid concentrate for cleaning composition,
the liquid concentrate for cleaning composition comprising, as organic solvents, at least a first organic solvent and a second organic solvent,
wherein the first organic solvent is at least one compound selected from the group consisting of a hydrophobic glycol ether compound, a hydrophobic hydrocarbon compound, a hydrophobic aromatic compound, a hydrophobic ketone compound and a hydrophobic alcohol compound, which has a boiling point in the range of 140° C. to 190° C. and a solubility in water (measurement temperature: 20° C.) of 50% by weight or less;
the second organic solvent is a hydrophilic amine compound having a boiling point in the range of 140° C. to 190° C. and a solubility in water (measurement temperature: 20° C.) of greater than 50% by weight;
the amount of incorporation of the second organic solvent is adjusted to a value in the range of 0.3 parts to 30 parts by weight relative to 100 parts by weight of the first organic solvent;
in case further comprising, as a third organic solvent, at least one compound selected from the group consisting of a hydrophilic glycol ether compound, a hydrophilic alcohol compound, a hydrophilic nitrogen-containing compound and a hydrophilic sulfur-containing compound, which has a boiling point in the range of 140° C. to 190° C. and a solubility in water (measurement temperature: 20° C.) of 50% by weight or greater, the amount of incorporation of the third organic solvent is adjusted to a value in the range of 150 parts by weight or less relative to 100 parts by weight of the first organic solvent; and
the amount of incorporation of an organic solvent which has a boiling point of higher than 190° C. is adjusted to a value of 0 parts by weight, or a value in the range of 0 parts to 15 parts by weight (provided that 0 parts by weight is excluded), relative to 100 parts by weight of the first organic solvent.

### Claim 2 (depends on 1)

The liquid concentrate for cleaning composition according to claim 1, wherein the first organic solvent is selected to be an organic solvent having an SP value in the range of 6.5 to 12 is used, and also, the second organic solvent is selected to be an organic solvent having an SP value in the range of 8 to 15.

### Claim 3 (depends on 1)

The liquid concentrate for cleaning composition according to claim 1, wherein the first organic solvent is at least one compound selected from the group consisting of propylene glycol monobutyl ether, dipropylene glycol dimethyl ether, n-hexanol, n-heptanol, n-nonane, n-decane, 1-decene, isononane, isodecane, isoundecane, isododecane, cymene and anisole.

### Claim 4 (depends on 1)

The liquid concentrate for cleaning composition according to claim 1, wherein the second organic solvent is at least one compound selected from the group consisting of N,N-diethylisopropanolamine, N-ethylethanolamine, N-methylethanolamine, benzylamine, and monoisopropanolamine.

### Claim 5

(canceled)

### Claim 6 (depends on 1)

The liquid concentrate for cleaning composition according to claim 1, further comprising, as a fourth organic solvent, a hydrophobic amine compound having a boiling point in the range of 140° C. to 190° C. and a solubility in water (measurement temperature: 20° C.) of 50% by weight or less, wherein the amount of incorporation of the fourth organic solvent is adjusted to a value in the range of 0.3 parts to 30 parts by weight relative to 100 parts by weight of the first organic solvent.

### Claim 7

A cleaning composition intended for cleaning an object to be cleaned in a clouded state, the cleaning composition comprising 100 parts by weight of a liquid concentrate for cleaning composition and 50 to 1900 parts by weight of water,
wherein the liquid concentrate for cleaning composition includes, as organic solvents, at least a first organic solvent and a second organic solvent;
the first organic solvent is at least one compound selected from the group consisting of a hydrophobic glycol ether compound, a hydrophobic hydrocarbon compound, a hydrophobic aromatic compound, a hydrophobic ketone compound and a hydrophobic alcohol compound, which has a boiling point in the range of 140° C. to 190° C. and a solubility in water (measurement temperature: 20° C.) of 50% by weight or less;
the second organic solvent is a hydrophilic amine compound having a boiling point in the range of 140° C. to 190° C. and a solubility in water (measurement temperature: 20° C.) of greater than 50% by weight;
the amount of incorporation of the second organic solvent is adjusted to a value in the range of 0.3 parts to 30 parts by weight relative to 100 parts by weight of the first organic solvent;
in case further comprising, as a third organic solvent, at least one compound selected from the group consisting of a hydrophilic glycol ether compound, a hydrophilic alcohol compound, a hydrophilic nitrogen-containing compound and a hydrophilic sulfur-containing compound, which has a boiling point in the range of 140° C. to 190° C. and a solubility in water (measurement temperature: 20° C.) of 50% by weight or greater, the amount of incorporation of the third organic solvent is adjusted to a value in the range of 150 parts by weight or less relative to 100 parts by weight of the first organic solvent; and
the amount of incorporation of an organic solvent which has a boiling point of higher than 190° C. is adjusted to a value of 0 parts by weight, or a value in the range of 0 parts to 15 parts by weight (provided that 0 parts by weight is excluded), relative to 100 parts by weight of the first organic solvent.

### Claim 8

A cleaning method comprising:
a step for mixing 100 parts by weight of a liquid concentrate for cleaning composition with 50 parts to 1900 parts by weight of water; and
a step for cleaning an object to be cleaned in a clouded state,
wherein the liquid concentrate for cleaning composition includes, as organic solvents, at least a first organic solvent and a second organic solvent;
the first organic solvent is at least one compound selected from the group consisting of a hydrophobic glycol ether compound, a hydrophobic hydrocarbon compound, a hydrophobic aromatic compound, a hydrophobic ketone compound and a hydrophobic alcohol compound, which has a boiling point in the range of 140° C. to 190° C. and a solubility in water (measurement temperature: 20° C.) of 50% by weight or less;
the second organic solvent is a hydrophilic amine compound having a boiling point in the range of 140° C. to 190° C. and a solubility in water (measurement temperature: 20° C.) of greater than 50% by weight;
the amount of incorporation of the second organic solvent is adjusted to a value in the range of 0.3 parts to 30 parts by weight relative to 100 parts by weight of the first organic solvent;
in case further comprising, as a third organic solvent, at least one compound selected from the group consisting of a hydrophilic glycol ether compound, a hydrophilic alcohol compound, a hydrophilic nitrogen-containing compound and a hydrophilic sulfur-containing compound, which has a boiling point in the range of 140° C. to 190° C. and a solubility in water (measurement temperature: 20° C.) of 50% by weight or greater, the amount of incorporation of the third organic solvent is adjusted to a value in the range of 150 parts by weight or less relative to 100 parts by weight of the first organic solvent; and
the amount of incorporation of an organic solvent which has a boiling point of higher than 190° C. is adjusted to a value of 0 parts by weight, or a value in the range of 0 parts to 15 parts by weight (provided that 0 parts by weight is excluded), relative to 100 parts by weight of the first organic solvent.