Methods Of Forming Circuit Structures Within Openings And Methods Of Forming Conductive Lines Across At Least A Portion Of A Substrate

A method of forming a circuit structure within an opening, comprising:

• providing support material over a substrate;
• forming spaced projections that project elevationally relative to the support material on opposing sides of an opening formed into the support material, the projections having respective elevationally outermost portions and elevationally innermost portions, the respective outermost portions being laterally narrower than the respective innermost portions;
• forming conductive metal elevationally over the projections and into and overfilling the opening, the metal being of a composition different from that of at least the elevationally outermost portions of the projections;
• and
• removing the metal from being elevationally over the projections and removing at least some of the metal between the projections.

A method of forming a circuit structure within an opening, comprising:

• providing support material over a substrate;
• forming spaced projections that project elevationally relative to the support material on opposing sides of an opening formed into the support material, the projections having respective bases that are everywhere spaced laterally outward from elevationally outermost portions of the opposing sides of the opening;
• forming conductive metal elevationally over the projections and into and overfilling the opening, the metal being of a composition different from that of at least elevationally outermost portions of the projections;
• and
• removing the metal from being elevationally over the projections and removing at least some of the metal between the projections.

A method of forming a circuit structure within an opening, comprising:

• forming an opening in masking material that is elevationally outward of support material of a substrate;
• forming a lining laterally over opposing sidewalls of the opening in the masking material;
• using the masking material and lining as a mask while removing support material to extend the opening into the support material;
• removing the masking material to leave the lining projecting elevationally outward relative to the extended opening in the support material;
• forming conductive metal elevationally over the lining and into and overfilling the extended opening in the support material, the metal being of a composition different from that of at least elevationally outermost portions of the lining;
• and
• removing the metal from being elevationally over the lining and removing at least some of the metal between the lining.

A method of forming conductive lines across at least a portion of a substrate, comprising:

• providing support material over a substrate and projection material over the support material;
• forming trenches through the projection material and into the support material;
• laterally narrowing elevationally outermost portions of the projection material between the trenches compared to elevationally innermost portions of the projection material between the trenches;
• forming conductive metal elevationally over the projection material into and overfilling the trenches, the metal being of a composition different from that of at least the narrowed elevationally outermost portions of the projection material;
• and
• removing the metal from being elevationally over tops of the elevationally outermost portions of the projection material and removing at least some of the metal between the projection material.

A method of forming a circuit structure within an opening, comprising:

• providing support material over a substrate;
• forming spaced projections that project elevationally relative to the support material on opposing sides of an opening formed into the support material, the projections having respective elevationally outermost portions and elevationally innermost portions, the respective outermost portions being laterally wider than the respective innermost portions;
• forming conductive metal elevationally over the projections and into and overfilling the opening, the metal being of a composition different from that of at least the elevationally outermost portions of the projections;
• and
• removing the metal from being elevationally over the projections and removing at least some of the metal between the projections.

A method of forming conductive lines across at least a portion of a substrate, comprising:

• providing support material over a substrate and projection material over the support material;
• forming trenches through the projection material and into the support material;
• laterally narrowing elevationally innermost portions of the projection material between the trenches compared to elevationally outermost portions of the projection material between the trenches;
• forming conductive metal elevationally over the projection material into and overfilling the trenches, the metal being of a composition different from that of at least the narrowed elevationally outermost portions of the projection material;
• and
• removing the metal from being elevationally over tops of the elevationally outermost portions of the projection material and removing at least some of the metal between the projection material.