Method of Fabricating Integrated Circuits
AssigneeSilverbrook Research Pty Ltd
InventorsAndrew Leon Vella, David McLeod Johnstone, Kia Silverbrook
Life of this patent
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Abstract
A method of fabricating integrated circuits is provided in which sacrificial material is provided on a first surface of a substrate to define structural elements, integrated circuit material is provided on the sacrificial material to provide integrated circuit structures as defined by the structural elements, the sacrificial material is removed from the first surface of the substrate to provide partially fabricated integrated circuits defined by the integrated circuit structures, a carrier handle is attached to the partially fabricated integrated circuits, and the substrate is thinned from a second surface of the substrate opposite the first surface to provide the fabricated integrated circuits.
Claims6
A method of fabricating integrated circuits, the method comprising:
- providing sacrificial material on a first surface of a substrate to define structural elements;
- providing integrated circuit material on the sacrificial material to provide integrated circuit structures as defined by the structural elements;
- removing the sacrificial material from the first surface of the substrate to provide partially fabricated integrated circuits defined by the integrated circuit structures;
- attaching a carrier handle to the partially fabricated integrated circuits;
- and
- thinning the substrate from a second surface of the substrate opposite the first surface to provide the fabricated integrated circuits.
Dependencies are inferred from the claim text.