US 2013/0095613 A1 · FABRICATION METHOD OF SEMICONDUCTOR DEVICES AND FABRICATION SYSTEM OF SEMICONDUCTOR DEVICES

Abstract

In aspects of the invention, a holding stage of a pick up system can include a first stage on which a semiconductor chip is mounted with an adhesive sheet put in between, a second stage supporting the first stage, and an evacuation pipe. The first stage can be provided with a plurality of grooves, projections each being formed with side walls of adjacent grooves, and air holes connected to the grooves. The semiconductor chip can be mounted on the first stage so that the whole end portion of the semiconductor chip does not position on one groove. Then, a closed space surrounded by the adhesive sheet and the first and second stages and can be evacuated to make the semiconductor chip held on the projections. Thereafter, the semiconductor chip can be picked up by a collet.

Claims11

Dependent claims

A method of fabricating semiconductor devices by picking up a semiconductor chip, which is formed by cutting a semiconductor wafer stuck to an adhesive sheet with dicing, from the adhesive sheet, the method comprising the steps of:

preparing a stage having a plurality of grooves on the upper surface thereof, an evacuation means, and a suction means applying suction to the semiconductor chip;
mounting the semiconductor chip on the stage so that the direction of an end portion of the semiconductor chip forms a specified angle with the direction of the grooves on the stage with the side of the surface of the semiconductor chip having the adhesive sheet stuck thereto made to be on the stage side;
making the semiconductor chip held at top portions formed by the end portions on the opening side of the grooves on the stage with the adhesive sheet put in between with a space, surrounded by the adhesive sheet contacting the stage and the grooves on the stage, being evacuated by the evacuation means;
and
applying suction to the semiconductor chip held at the top portions by the suction means to pick up the semiconductor chip.

2 more elements

A system for fabricating semiconductor devices by picking up a semiconductor chip, which is formed by cutting a semiconductor wafer stuck to an adhesive sheet with dicing, from the adhesive sheet, the system comprising:

a stage on which the semiconductor chip is mounted, the stage having a plurality of grooves formed at specified intervals on the surface thereof on which the semiconductor chip is mounted and at least one air hole formed in the stage to be connected to at least one of the grooves;
top portions formed by the end portions on the opening side of the grooves for holding the semiconductor chip thereon with the adhesive sheet put in between;
an evacuation means for evacuating a space through the air hole, the space being surrounded by the adhesive sheet stuck to the stage side surface of the semiconductor chip mounted on the stage and the grooves which the stage has thereon;
and
a suction means applying suction to the semiconductor chip to pick up the semiconductor chip being held only at the top portions with the space evacuated by the evacuation means,
the semiconductor chip being mounted on the stage so that the direction of an end portion of the semiconductor chip forms a specified angle with the direction of the grooves with the side of the surface of the semiconductor chip having the adhesive sheet stuck thereto made to be on the stage side.

3 more elements

Dependencies are inferred from the claim text.

Fabrication method of semiconductor devices and fabrication system of semiconductor devices

Life of this patent

Fabrication method of semiconductor devices and fabrication system of semiconductor devices

Life of this patent

Abstract

Claims11