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US 2013/0095609 A1Published application
Device and Method for Manufacturing a Device
AssigneeInfineon Technologies AG
InventorHorst Theuss
Life of this patent
Estimating the term…
Abstract
A device includes a first semiconductor chip and a first encapsulant that encapsulates the first semiconductor chip and that includes a cavity. A carrier and an electrical component are mounted on the carrier. The carrier is arranged such that the electrical component is enclosed by the cavity.
Claims20
A method for manufacturing a device, the method comprising:
- encapsulating a first semiconductor chip with a first encapsulant, wherein the first encapsulant comprises a cavity;
- mounting an electrical component on a carrier;
- and
- placing the carrier on a first main surface of the encapsulant such that the electrical component is enclosed by the cavity.
1 more element
A method for manufacturing a packaged semiconductor device, the method comprising:
- encapsulating semiconductor chips such that a cavity is formed on a first main surface of an encapsulant and over each semiconductor chips;
- forming a redistribution layer over a second main surface of the encapsulant such that the semiconductor chips are connected to the redistribution layer;
- forming first through vias in the encapsulant such that the first main surface is connected to the second main surface;
- locating a semiconductor components in the cavities by placing an assembled semiconductor component on the first main surface of the encapsulant;
- and
- singulating the encapsulant forming the packaged semiconductor device such that the packaged semiconductor device comprises a first semiconductor chip, a second semiconductor chip, a first through via and a semiconductor component.
3 more elements
A method for manufacturing a device, the method comprising:
- encapsulating a first semiconductor chip with a first encapsulant;
- forming a first redistribution layer on the first encapsulant;
- placing an electrical component on the first redistribution layer;
- forming a second encapsulant having a cavity;
- and
- placing a first main surface of the second encapsulant on a first main surface of the first encapsulant such that the electrical component is enclosed by the cavity.
3 more elements
Dependencies are inferred from the claim text.