Transparent material processing with an ultrashort pulse laser
AssigneeImra America, Inc.
InventorsJames BOVATSEK, Alan Y. Arai, Fumiyo Yoshino
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AssigneeImra America, Inc.
InventorsJames BOVATSEK, Alan Y. Arai, Fumiyo Yoshino
Estimating the term…
Methods for ultrashort pulse laser processing of optically transparent materials. A method for scribing transparent materials uses ultrashort laser pulses to create multiple scribe features with a single pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. Slightly modifying the ultrashort pulse laser processing conditions produces sub-surface marks. When properly arranged, these marks are clearly visible with side-illumination and not clearly visible without side-illumination. In addition, a method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating. The ultrashort pulse duration causes nonlinear absorption of the laser radiation, and the high repetition rate of the laser causes pulse-to-pulse accumulation of heat within the materials.
A method for bonding transparent materials, comprising:
A method for welding transparent materials, comprising:
A method for creating a raised ridge at the interface between two opposed surfaces to be welded to fill a gap that cannot be bridged by welding alone, comprising:
An optical system for welding transparent materials, comprising:
A method for welding transparent materials, comprising:
Dependencies are inferred from the claim text.