Compact, highly integrated microphone assembly
AssigneeKnowles Electronics, LLC
InventorsEric J. Lautenschlager, Galen Kirkpatrick
Life of this patent
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Abstract
A microelectromechanical (MEMS) microphone assembly includes a MEMS structure, a base portion, and a lid. The MEMS structure includes a diaphragm that responds to changes in sound pressure and the MEMS structure contributes to a vertical dimension of the assembly. The MEMS structure is supported by the base portion. The lid partially but not completely encloses the MEMS structure, such that the portion of the MEMS structure is not surrounded by the lid, the lid, and the base portion form a boundary with and are exposed to the environment external to the microphone assembly.
Claims7
A microelectromechanical (MEMS) microphone assembly, the assembly comprising:
- a MEMS structure, the MEMS structure including a diaphragm that responds to changes in sound pressure, the MEMS structure contributing to a vertical dimension of the assembly;
- a base portion, the MEMS structure being supported by the base portion;
- and
- a lid, the lid partially but not completely enclosing the MEMS structure, such that a portion of the MEMS structure not surrounded by the lid, the lid, and the base portion form a boundary with and are exposed to the environment external to the microphone assembly.
Dependencies are inferred from the claim text.