Molded Power Supply System Having a Thermally Insulated Component
AssigneeTexas Instruments Incorporated
InventorsMohamed Ashraf Mohd Arshad, Jin Keong Lim
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Abstract
A molded system (100) has a plurality of components (110, 120, 130) attached to a carrier (101), one of the components being an object (110) of irregular thermal capacitance. For example, carrier (101) may be a QFN/SON-type leadframe and object (110) an inductor of high thermal capacitance. The surface of the object is sealed with a hardened polymeric layer (220) of high thermal resistance, whereby the layer (220) thermally insulates the object (110) and inhibits the transport of thermal energy between the object and the system. System (100) has molding compound (140) encapsulating the carrier and the attached components including the object (110) and the polymeric layer sealing the object's surface.
Claims21
Method for molding a system including an object having irregular thermal capacitance, comprising the steps of:
- sealing the surface of the object having irregular thermal capacitance with a polymeric layer having high thermal resistance, thus thermally insulating the object;
- and
- then molding over the sealed surface to encapsulate the object and the system in a molding compound.
A molded system comprising:
- a plurality of components attached to a carrier, one of the components being an object of irregular thermal capacitance;
- the surface of the object sealed with a hardened polymeric layer of high thermal resistance, the layer thermally insulating the object;
- and
- molding compound encapsulating the carrier and the attached components including the object and the polymeric layer sealing the object's surface.
Dependencies are inferred from the claim text.