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AssigneeKoninklijke Philips Electronics N.V.
InventorsJohannes Wilhelmus Weekamp, Antonius Constant Johanna Cornelis Van Den Ackerveken, Will J.H. Ansems
Estimating the term…
A package enclosing at least one microelectronic element (60) such as a sensor die and having electrically conductive connection pads (31) for electric connection of the package to another device is manufactured by providing a sacrificial carrier; applying an electrically conductive pattern (30) to one side of the carrier; bending the carrier in order to create a shape of the carrier in which the carrier has an elevated portion and recessed portions; forming a body member (45) on the carrier at the side where the electrically conductive pattern (30) is present; removing the sacrificial carrier; and placing a microelectronic element (60) in a recess (47) which has been created in the body member (45) at the position where the elevated portion of the carrier has been, and connecting the microelectronic element (60) to the electrically conductive pattern (30). Furthermore, a hole (41) is arranged in the package for providing access to a sensitive surface of the microelectronic element (60).
A method of manufacturing a package carrier (55) suitable for enclosing at least one microelectronic element (60, 61) and having electrically conductive connection pads (31) for electric connection of the package carrier (55) to another device, comprising following steps:
A package carrier (55), comprising:
Dependencies are inferred from the claim text.