Method and apparatus for reducing pressure effects on an encapsulated device
AssigneeEnphase Energy, Inc.
InventorsMartin Fornage, Raghuveer R. Belur
Life of this patent
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Abstract
A method and apparatus for reducing pressure effects on an encapsulated device. In one embodiment, the apparatus comprises a power module comprising an equipment box assembly containing (i) an equipment module housing, (ii) a potted electronic device disposed within the equipment module housing, and (iii) a resilient expansion absorption layer disposed between at least a portion of the potted electronic device and at least a portion of the equipment module housing.
Claims20
An apparatus for reducing pressure effects on an encapsulated device, comprising:
- a power module comprising an equipment box assembly containing (i) an equipment module housing, (ii) a potted electronic device disposed within the equipment module housing, and (iii) a resilient expansion absorption layer disposed between at least a portion of the potted electronic device and at least a portion of the equipment module housing.
A method for reducing pressure effects on an encapsulated device, comprising:
- potting an electronic device to produce a potted electronic device;
- disposing the potted electronic device within an equipment module housing;
- and
- disposing a resilient expansion absorption layer between at least a portion of the potted electronic device and at least a portion of the equipment module housing to produce an equipment box assembly.
Dependencies are inferred from the claim text.