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US 2013/0093455 A1Published application
Tsv testing method and apparatus
AssigneeTexas Instruments Incorporated
InventorLee D. Whetsel
Life of this patent
Estimating the term…
Abstract
The disclosure describes a novel method and apparatus for testing TSVs in a single die or TSV connections in a stack of die.
Claims20
An integrated circuit die including;
- an upper surface and a lower surface,
- TSVs each having contact points on the upper and lower surfaces of the die,
- a scan cell associated with each TSV and upper and lower contact points, the scan cell including;
- a serial input,
- a serial output,
- control inputs,
- a voltage reference input,
- a response input coupled to the upper surface contact point, and;
- a stimulus output coupled to the lower surface contact point.
6 more elements
A scan cell including;
- a test response input terminal, a voltage reference input terminal, a serial data input terminal, a clock input terminal, a control input terminal, a serial data output terminal, an output enable input terminal, and a test stimulus output terminal,
- a comparator having an input coupled to the test response input terminal, an input coupled to the voltage reference input terminal and an output,
- a multiplexer having an input coupled to the output of the comparator, an input coupled to the serial data input terminal, an input coupled to the control input terminal and an output,
- a memory having an input coupled to the output of the multiplexer, an input coupled to the clock input terminal and an output coupled to the serial data output terminal, and;
- a 3-state buffer having an input coupled to the output of the memory, an input coupled to the output enable input terminal and an output coupled to the test stimulus output terminal.
2 more elements
An integrated circuit die including;
- an upper surface and a lower surface,
- TSVs each having contact points on the upper and lower surfaces of the die,
- a scan cell associated with each TSV having an input for receiving test response from the upper surface contact point and an output for providing test stimulus to the lower surface contact point,
- an electrical connection formed between the upper surface contact point and its associated TSV,
- an electrical connection formed between the lower surface contact point and its associated TSV,
- a serial connection formed between the scan cells for communicating serial test data through the scan cells, and;
- a TAP having a TDI signal input, a TCK signal input, a TMS signal input, an interface for communicating serial test data through the serially connected scan cells and a TDO signal output.
4 more elements
A process of testing a TSV in a die including the steps of;
- applying a voltage from a scan cell to a contact point on the bottom surface of the die connected to a TSV,
- passing the applied voltage through the TSV to a connected contact point on the top surface of the die,
- comparing the voltage on the contact point on the top surface of the die against a voltage reference, and;
- capturing the result of the comparing into a scan cell.
1 more element
A process of testing a TSV in a die including the steps of;
- placing an external load resistor on a contact point on the top surface of the die connected to a TSV,
- applying a voltage from a scan cell to a contact point on the bottom surface of the die connected to the TSV,
- passing a current induced by the applied voltage through the TSV connected to the contact point on the bottom surface of the die, through the contact point on the top surface of the die, and through the external load resistor,
- comparing the voltage drop across the load resistor against a voltage reference, and;
- capturing the result of the comparing into a scan cell.
2 more elements
A die stack including;
- a lower die having a bottom surface including contact points for a voltage reference signal, a TDI signal, a TMS signal, a TCK signal and a TDO signal, a top surface including contact points for a voltage reference signal, a TDO signal, a TMS signal, a TCK signal and a TDI signal,
- an upper die having a bottom surface including contact points for a voltage reference signal, a TDI signal, a TMS signal, a TCK signal and a TDO signal, and;
- a connection formed between the voltage reference contact point of the top surface of the lower die and the voltage reference contact point of the bottom surface of the upper die,
- a connection formed between the TDO signal contact point of the top surface of the lower die and the TDI signal contact point of the bottom surface of the upper die,
- a connection formed between the TMS signal contact point of the top surface of the lower die and the TMS signal contact point of the bottom surface of the upper die,
- a connection formed between the TCK signal contact point of the top surface of the lower die and the TCK signal contact point of the bottom surface of the upper die, and;
- a connection formed between the TDI signal contact point of the top surface of the lower die and the TDO signal contact point of the bottom surface of the upper die.
4 more elements
An integrated circuit die including;
- a TSV having top and bottom surfaces and conductive material therein between,
- a die contact point connected to the top TSV surface,
- a die contact point connected to the bottom TSV surface,
- a connection formed between the contact point connected to the top TSV surface and a test response input to a scan cell, and;
- a connection formed between the contact point connected to the bottom TSV surface and a test stimulus output from the scan cell.
2 more elements
An integrated circuit die including;
- a TSV having top and bottom surfaces and conductive material therein between,
- a die contact point connected to the top TSV surface,
- a die contact point connected to the bottom TSV surface,
- a first switch having a first terminal connected to the top surface contact point, second terminal connected to the TSV at point in close proximity to the top TSV surface, a third terminal connected to a response input of a scan cell and a fourth terminal connected to a switch control signal, and;
- a second switch having a first terminal connected to the bottom surface contact point, second terminal connected to the TSV at point in close proximity to the bottom TSV surface, a third terminal connected to a stimulus output from the scan cell and a fourth terminal connected to a switch control signal.
2 more elements
An integrated circuit die including;
- a TSV connected between a top surface contact point of the die and a bottom surface contact point of the die, and;
- a scan cell having a response input selectively coupled to one of the top surface contact point and the TSV and a stimulus output selectively coupled to one of the bottom surface contact point and the TSV.
An integrated circuit die including;
- a TSV connected between a top surface contact point of the die and a bottom surface contact point of the die,
- a scan cell having a response input connected to the top surface contact point and a stimulus output connected to the bottom surface contact point, and;
- a load resistor selectively coupled to the top surface contact point.
An integrated circuit die including;
- a TSV connected between a top surface contact point of the die and a bottom surface contact point of the die,
- a scan cell having a response input selectively coupled to one of the top surface contact point and the TSV and a stimulus output selectively coupled to one of the bottom surface contact point and the TSV, and;
- a load resistor selectively coupled to top surface contact point.
An integrated circuit die including;
- a TSV connected between a top surface contact point of the die and a bottom surface contact point of the die,
- a scan cell having a response input selectively coupled to one of the top surface contact point and the TSV and a stimulus output selectively coupled to one of the bottom surface contact point and the TSV, and;
- a load resistor selectively coupled to the top surface contact point.
An integrated circuit die including;
- a TSV connected between a top surface contact point of the die and a bottom surface contact point of the die,
- a scan cell having a response input selectively coupled to one of the top surface contact point and the TSV and a stimulus output selectively coupled to one of the bottom surface contact point and the TSV,
- a load resistor selectively coupled to top surface contact point, and;
- a circuit on the die having an output coupled to the TSV via one of a 3-state buffer and analog switch.
1 more element
An integrated circuit die including;
- a TSV connected between a top surface contact point of the die and a bottom surface contact point of the die,
- a scan cell having a response input selectively coupled to one of the top surface contact point and the TSV and a stimulus output selectively coupled to one of the bottom surface contact point and the TSV, and;
- a circuit on the die having an output coupled to the TSV via one of a 3-state buffer and analog switch.
An integrated circuit die including;
- a TSV connected between a top surface contact point of the die and a bottom surface contact point of the die,
- a scan cell having a response input connected to the top surface contact point and a stimulus output connected to the bottom surface contact point,
- a load resistor selectively coupled to the top surface contact point, and;
- a circuit on the die having an output coupled to the TSV via one of a 3-state buffer and analog switch.
1 more element
An integrated circuit die including;
- a TSV connected between a top surface contact point of the die and a bottom surface contact point of the die,
- a scan cell having a response input connected to the top surface contact point and a stimulus output connected to the bottom surface contact point, and;
- a circuit on the die having an output coupled to the TSV via one of a 3-state buffer and analog switch.
Dependencies are inferred from the claim text.