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US 2013/0093104 A1Published application
Bond pad structure and fabricating method thereof
AssigneeUnited Microelectronics Corp.
InventorsHui-Min WU, Ming-I Wang, Kuan-Yu Wang, Kun-Che Hsieh, Chien-Hsin Huang
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Abstract
A bond pad structure comprises an interconnection structure and an isolation layer. The dielectric layer has an opening and a metal pad. The isolation layer is disposed on the interconnection structure and extends into the opening until it is in contact with the metal pad, whereby the sidewalls of the opening is blanketed by the isolation layer, and a portion of the metal pad is exposed from the opening.
Claims20
A bond pad structure, comprising:
- an interconnection structure, having an opening and a metal pad;
- and
- an isolation layer, disposed on the interconnection structure and extending into the opening until in contact with the metal pad, whereby sidewalls of the opening are blanketed by the isolation layer, and a portion of the metal pad is exposed from the opening.
A micro-electro-mechanical systems (MEMS) device, comprising:
- a substrate;
- a transistor, formed on the substrate;
- a micro-electromechanical element, formed on the substrate;
- and
- a bond pad structure, comprising:
- an interconnection structure, formed on the substrate and having an opening and a metal pad electrically connected to the transistor and the micro-electromechanical element;
- and
- an isolation layer disposed on the interconnection structure and extending into the opening until in contact with the metal pad, whereby the sidewalls of the opening are blanketed by the isolation layer, and a portion of the metal pad is exposed from the opening.
5 more elements
A method for fabricating a bond pad structure, comprising:
- providing an interconnection structure having an inter-layer dielectric (ILD) and at least one metal pad;
- forming an opening on the ILD so as to expose a portion of the metal pad;
- forming an isolation layer on the ILD to cover the sidewalls of the opening and the exposed metal pad;
- and
- patterning the isolation layer to expose a portion of the metal pad from the opening.
2 more elements
Dependencies are inferred from the claim text.