Semiconductor apparatus
AssigneeHynix Semiconductor Inc.
InventorsSang Hoon SHIN, Dong Uk LEE
Life of this patent
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Abstract
A semiconductor apparatus having first and second chips stacked upon each other includes first, second and third through vias positioned on a same vertical lines in the first and second chips and formed through the first and second chips. A first input/output circuit connected with the second through via of the first chip. A second input/output circuit connected with the second through via of the second chip. The second through via of the second chip is connected with the first through via of the first chip.
Claims21
A semiconductor apparatus having first and second chips stacked upon each other, comprising:
- first, second and third through vias positioned on same vertical lines in the first and second chips and formed through the first and second chips;
- a first input/output circuit connected with the second through via of the first chip;
- and
- a second input/output circuit connected with the second through via of the second chip,
- wherein the second through via of the second chip is connected with the first through via of the first chip.
A semiconductor apparatus having first to nth chips (n is an integer equal to or greater than 3) stacked upon one another, comprising:
- first to mth (m is an integer greater than n) through vias positioned on same vertical lines in the first to nth chips and formed through the first to nth chips;
- and
- input/output circuits respectively connected with n*kth (k is a natural number) through vias of the first to nth chips,
- wherein the nth through via of the nth chip is connected with the n−1th through via of the n−1th chip, and the nth through via of the n−1th chip is connected with the n+1th through via of the nth chip and the n−1th through via of the n−2th chip.
A semiconductor apparatus having first, second, third and fourth chips sequentially stacked upon one another, the first and second chips constituting a first rank and the third and fourth chips constituting a second rank, comprising:
- first, second, third and fourth through vias positioned on the same vertical lines in the first, second, third and fourth chips and formed through the first, second, third and fourth chips;
- input/output circuits connected with the second through vias of the first, second, third and fourth chips;
- and
- input/output circuits connected with the fourth through vias of the first, second, third and fourth chips,
- wherein the fourth through via of the fourth chip is connected sequentially with the third through via of the third chip, the second through via of the second chip and the first through via of the first chip, and forms a first channel.
A semiconductor apparatus having first, second, third and fourth chips sequentially stacked upon one another, the first and second chips constituting a first rank and the third and fourth chips constituting a second rank, comprising:
- first, second and third through vias positioned on the same vertical lines in the first, second, third and fourth chips and formed through the first, second, third and fourth chips;
- and
- input/output circuits connected with the second through vias of the first, second, third and fourth chips,
- wherein the second through via of the fourth chip is connected sequentially with the first through via of the third chip, the second through via of the second chip and the first through via of the first chip, and forms a first channel.
Dependencies are inferred from the claim text.