Package-On-Package (PoP) Structure and Method

A package-on-package (PoP) structure comprising:

• an interposer having a first side and a second side opposite the first side;
• a first die on the second side of the interposer;
• a first substrate on and coupled to the second side of the interposer by first electrical connectors, the first substrate comprising:
• a first core material having a first surface and a second surface;
• a first redistribution layer (RDL) on the first surface of the first core material, the first RDL being coupled to the first electrical connectors;
• a second die disposed in the first core material between the first surface of the first core material and the second surface of the first core material;
• and
• a second RDL on the second surface of the first core material;
• and
• a third die on the first substrate.

A method for forming a package-on-package (PoP) structure, the method comprising:

• applying a first molding compound on a first die, first electrical connectors electrically coupled to the first die being exposed through a first surface of the first molding compound;
• forming a first redistribution layer (RDL) on the first surface of the first molding compound, the first RDL on the first molding compound being electrically coupled to the first electrical connectors;
• forming a second RDL on a second surface of the first molding compound;
• attaching a second die to one of the first RDL on the first molding compound and the second RDL on the first molding compound;
• and
• attaching second electrical connectors to one of the first RDL on the first molding compound and the second RDL on the first molding compound and to a first side of an interposer, the interposer having a third die on the first side of the interposer.