Semiconductor package and method of fabricating the same
AssigneeSiliconware Precision Industries Co., Ltd.
InventorsPang-Chun Lin, Yueh-Ying Tsai, Yong-Liang Chen
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Abstract
This disclosure provides a semiconductor package and a method of fabricating the same. The semiconductor package includes an insulating layer; a plurality of traces and connection pads disposed in the insulating layer and protruded from the insulating layer; a plurality of bumps formed on the plurality of traces; a semiconductor chip disposed on the bumps; and an encapsulant formed on the insulating layer to encapsulate the semiconductor chip, the plurality of bumps, traces and connection pads. When the encapsulant is formed, voids can be prevented from being generated in the traces and the connection pads and thus the yield of process is significantly increased.
Claims11
A semiconductor package comprising:
- an insulating layer having a top surface and a bottom surface;
- a plurality of traces and connection pads formed in the insulating layer and protruded from the top surface of the insulating layer, wherein the connection pads are further exposed from the bottom surface of the insulating layer;
- a plurality of bumps formed on the plurality of traces;
- a semiconductor chip disposed on the bumps;
- and
- an encapsulant formed on the insulating layer to encapsulate the semiconductor chip, the bumps, the traces and the connection pads.
A method of fabricating a semiconductor package, comprising:
- forming on a substrate a metal layer with patterned trenches;
- forming a plurality of traces and connection pads in the patterned trenches, wherein a thickness of each of the traces and connection pads is greater than a depth of each of the patterned trenches;
- forming an insulating layer for encapsulating the traces and connection pads on the metal layer in a manner that bottom surfaces of the connection pads are exposed from the insulating layer;
- removing a portion of the substrate and the metal layer, so as for the traces and connection pads to be exposed and protruded from the insulating layer;
- attaching a semiconductor chip to the traces by a plurality of bumps;
- and
- forming an encapsulant on the insulating layer for encapsulating the semiconductor chip, the bumps, the traces and the connection pads.
Dependencies are inferred from the claim text.