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US 2013/0093084 A1Published application
Wafer-Level Chip Scale Package with Re-Workable Underfill
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsHsien-Wei Chen, Tsung-Ding Wang, Chien-Hsiun Lee, Hao-Yi Tsai, Mirng-Ji Lii, Chen-Hua Yu
Life of this patent
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Abstract
A package includes a printed circuit board (PCB), and a die bonded to the PCB through solder balls. A re-workable underfill is dispensed in a region between the PCB and the die.
Claims20
A package comprising:
- a printed circuit board (PCB);
- a die bonded to the PCB through solder balls;
- and
- a re-workable underfill dispensed in a region between the PCB and the die.
1 more element
A package comprising:
- a printed circuit board (PCB);
- a die, wherein the region between the PCB and the die comprises:
- a center region adjacent to a center of the die;
- corner regions adjacent to corners of the die;
- and
- edge regions adjacent to edges of the die, wherein the corner regions and the edge regions surround the center region, and wherein each of the edge regions interconnects two of the corner regions;
- solder balls bonding the PCB to the die, wherein each of the center region, the edge regions, and the corner regions comprises at least one of the solder balls therein;
- and
- an underfill dispensed into one of the corner regions, wherein the underfill is not dispensed into the center region.
6 more elements
A package comprising:
- a printed circuit board (PCB);
- a die, wherein the region between the PCB and the die comprises:
- a center region;
- corner regions;
- and
- edge regions, with the corner regions and the edge regions surrounding the center region, wherein each of the edge regions interconnects two of the corner regions;
- solder balls bonding the PCB to the die, wherein each of the center region, the edge regions, and the corner regions comprises at least one of the solder balls therein;
- and
- an underfill dispensed into the corner regions to form discrete underfill regions separated from each other, wherein the underfill contacts the solder balls that are in the corner regions, wherein no underfill is filled into the center region, and wherein the underfill is in contact with the PCB, and is not in physical contact with the die.
6 more elements
Dependencies are inferred from the claim text.