US 2013/0093083 A1 · SEMICONDUCTOR DEVICE AND STACKED SEMICONDUCTOR DEVICE

Abstract

A semiconductor device according to one embodiment has a wiring circuit board, a semiconductor chip, a die attach material and bumps. The semiconductor chip is mounted on the wiring circuit board. The die attach material is provided between the wiring circuit board and the semiconductor chip. A wiring layer is provided on one surface of the wiring circuit board. Leads are extended from the wiring layer and connected to the semiconductor chip. The bumps are provided at outer positions relative to the region where the semiconductor chip of the wiring circuit board is mounted. The wiring layer in the wiring circuit board is formed on the surface opposite from the surface on which the semiconductor chip is mounted.

Claims20

Dependent claims

A semiconductor device comprising:

a first core member including a first surface and a second surface opposite to the first surface;
a first semiconductor chip mounted over the first surface of the first core member;
a plurality of first bumps provided on the second surface of the first core member;
a second core member including a third surface and a fourth surface opposite to the third surface, the second core member being stacked over the first semiconductor chip so that the fourth surface faces the first semiconductor chip;
a second semiconductor chip mounted over the third surface of the second core member;
and
a plurality of second bumps provided on the fourth surface of the second core member, the plurality of second bumps being arranged at positions that are outside of a region overlapping the first semiconductor chip, and the plurality of second bumps are smaller in diameter than the plurality of first bumps.

4 more elements

Dependencies are inferred from the claim text.

Semiconductor device and stacked semiconductor device

Life of this patent

Semiconductor device and stacked semiconductor device

Life of this patent

Abstract

Claims20