Ic chip package and chip-on-glass structure using the same
AssigneeNovatek Microelectronics Corp.
InventorTai-Hung Lin
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Abstract
An IC chip package and a chip-on-glass structure using the same are provided. The IC chip package includes an IC chip having a circuit surface, and plural copper (Cu) bumps formed on the circuit surface. Moreover, a non-conductive film (NCF) could be formed on the circuit surface to cover the Cu bumps. The chip-on-glass structure includes a glass substrate, plural electrodes such as aluminum (Al) electrodes formed on the glass substrate, and a conductive film formed on the electrodes. The conductive film contains a number of conductive particles. When the IC chip package is coupled to the glass substrate, the Cu bumps can be coupled to the corresponding electrodes via conductive particles.
Claims33
An IC chip package, comprising:
- an IC chip having a circuit surface;
- and
- a plurality of copper (Cu) bumps whose bottom surfaces contact the circuit surface.
An IC chip package, comprising:
- an IC chip having a circuit surface;
- a plurality of Cu bumps whose bottom surfaces contact the circuit surface, wherein the Cu bumps are realized by an alloy or a multi-layered structure, and a copper component of the Cu bumps is 30 wt %˜100 wt % of a total mass;
- and
- a nonconductive film (NCF) formed on the circuit surface, wherein the NCF covers the Cu bumps and is translucent.
Dependencies are inferred from the claim text.