Connector Structures of Integrated Circuits

A device comprising:

• a die comprising:
• a substrate;
• a first metal pad over the substrate;
• a passivation layer covering edge portions of the first metal pad;
• a first metal pillar over the first metal pad and extending over the passivation layer, wherein the first metal pad and the first metal pillar are in a first corner region of the die;
• a second metal pad over the substrate;
• a second metal pillar over the second metal pad, wherein the second metal pad and the second metal pillar are in a second corner region of the die, wherein the first and the second corner regions are on opposite sides of a center of the die, and wherein in a top view of the die, centers of the first and the second metal pillars are misaligned with centers of first and the second metal pads, respectively, and are shifted away from the center of the die relative to the centers of first and the second metal pads, respectively;
• and
• a package component bonded to the first and the second metal pillars, wherein the package component is selected from the group consisting essentially of a device die, an interposer, a package substrate, and a printed circuit board.

A device comprising:

• a die comprising a first, a second, a third, and a fourth corner, where the die further comprises:
• a substrate;
• a first, a second, a third, and a fourth metal pad over the substrate, wherein the first, the second, the third, and the fourth metal pads are closer to respective ones of the first, the second, the third, and the fourth corners than any other metal pad in the die;
• a passivation layer covering edge portions of the first, the second, the third, and the fourth metal pads;
• and
• a first, a second, a third, and a fourth metal pillar over respective ones of the first, the second, the third, and the fourth metal pads, and extending into openings in the passivation layer to electrically couple to the first, the second, the third, and the fourth metal pads, wherein centers of the first, the second, the third, and the fourth metal pads are shifted away from centers of the first, the second, the third and the fourth metal pads in directions toward the first, the second, third, and the fourth corners, respectively.